DocumentCode
610602
Title
New integration schemes for 2,5D interposer
Author
Matthias, T. ; Wimplinger, M. ; Pauzenberger, G. ; Lindner, Philipp
fYear
2013
fDate
22-24 April 2013
Firstpage
1
Lastpage
1
Abstract
2,5D interposer are a hot topic at the moment in the packaging world. An interposer allows to inter-chip communication between multiple chips with intra-chip interconnects. This enables unmatched bandwidth, reduced power consumption and very good heat spreading. The 2,5D interposer allows to implement a big part of the promise of 3D ICs without the need to make TSVs into the chips.
Keywords
integrated circuit interconnections; integrated circuit packaging; integration; thermal management (packaging); three-dimensional integrated circuits; 2,5D interposer; 3D IC; TSV; heat spreading; integration scheme; inter-chip communication; intra-chip interconnects; packaging world; power consumption; unmatched bandwidth; Bandwidth; Compounds; Heat sinks; Manufacturing; Packaging; Power demand; Stacking;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems, and Applications (VLSI-TSA), 2013 International Symposium on
Conference_Location
Hsinchu
Print_ISBN
978-1-4673-3081-7
Electronic_ISBN
978-1-4673-6422-5
Type
conf
DOI
10.1109/VLSI-TSA.2013.6545616
Filename
6545616
Link To Document