• DocumentCode
    610609
  • Title

    Microscopic degradation models for advanced technology

  • Author

    Bersuker, Gennadi

  • Author_Institution
    SEMATECH, Albany, NY, USA
  • fYear
    2013
  • fDate
    22-24 April 2013
  • Firstpage
    1
  • Lastpage
    1
  • Abstract
    New failure mechanisms can be expected to emerge with introduction of new materials and device structures. Reliability assessment is further complicated by increasing device-to-device variability associated with continuous scaling that demands ever increasing sample sizes for statistical evaluations. To mitigate this trend, the traditional statistical reliability analysis can be complemented by the microscopic degradation models, which are based on the atomic-level material properties and explicitly consider defect generation caused by the carrier-dielectric interaction.
  • Keywords
    dielectric properties; failure analysis; semiconductor device reliability; statistical analysis; carrier-dielectric interaction; device structures; device-to-device variability; failure mechanisms; microscopic degradation; reliability assessment; statistical reliability analysis; Degradation; Dielectrics; Microscopy; Reliability; Stress; Temperature distribution; Tin;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology, Systems, and Applications (VLSI-TSA), 2013 International Symposium on
  • Conference_Location
    Hsinchu
  • Print_ISBN
    978-1-4673-3081-7
  • Electronic_ISBN
    978-1-4673-6422-5
  • Type

    conf

  • DOI
    10.1109/VLSI-TSA.2013.6545623
  • Filename
    6545623