DocumentCode
610609
Title
Microscopic degradation models for advanced technology
Author
Bersuker, Gennadi
Author_Institution
SEMATECH, Albany, NY, USA
fYear
2013
fDate
22-24 April 2013
Firstpage
1
Lastpage
1
Abstract
New failure mechanisms can be expected to emerge with introduction of new materials and device structures. Reliability assessment is further complicated by increasing device-to-device variability associated with continuous scaling that demands ever increasing sample sizes for statistical evaluations. To mitigate this trend, the traditional statistical reliability analysis can be complemented by the microscopic degradation models, which are based on the atomic-level material properties and explicitly consider defect generation caused by the carrier-dielectric interaction.
Keywords
dielectric properties; failure analysis; semiconductor device reliability; statistical analysis; carrier-dielectric interaction; device structures; device-to-device variability; failure mechanisms; microscopic degradation; reliability assessment; statistical reliability analysis; Degradation; Dielectrics; Microscopy; Reliability; Stress; Temperature distribution; Tin;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology, Systems, and Applications (VLSI-TSA), 2013 International Symposium on
Conference_Location
Hsinchu
Print_ISBN
978-1-4673-3081-7
Electronic_ISBN
978-1-4673-6422-5
Type
conf
DOI
10.1109/VLSI-TSA.2013.6545623
Filename
6545623
Link To Document