DocumentCode :
610633
Title :
Low power negative capacitance FETs for future quantum-well body technology
Author :
Chun Wing Yeung ; Khan, A.I. ; Sarker, A. ; Salahuddin, Sania ; Chenming Hu
Author_Institution :
Dept. of Electr. Eng. & Comput. Sci., Univ. of California, Berkeley, Berkeley, CA, USA
fYear :
2013
fDate :
22-24 April 2013
Firstpage :
1
Lastpage :
2
Abstract :
A non-hysteretic NCFET structure using thin quantum well body combines two future trends synergistically. Ultra-thin body is needed to suppress short-channel effects and sub-60mV/decade operation is needed to reduce power consumption drastically. NCFET happens to need ultra-thin body as thin as 0.5nm to achieve 0.3V operation. We used simulation results of thin Si body NCFET to illustrate the possibility of achieving 10pA/μm IOFF, 200uA/um Ion with 0.3V supply voltage. Layered semiconductors would be ideal for this future technology.
Keywords :
field effect transistors; low-power electronics; quantum well devices; silicon; Si; layered semiconductors; low power negative capacitance FET; nonhysteretic NCFET structure; quantum-well body technology; short channel effects; size 0.5 nm; ultra-thin body; voltage 0.3 V; CMOS integrated circuits; Capacitance; Iron; Logic gates; MOSFET; Semiconductor device modeling; Silicon;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
VLSI Technology, Systems, and Applications (VLSI-TSA), 2013 International Symposium on
Conference_Location :
Hsinchu
Print_ISBN :
978-1-4673-3081-7
Electronic_ISBN :
978-1-4673-6422-5
Type :
conf
DOI :
10.1109/VLSI-TSA.2013.6545648
Filename :
6545648
Link To Document :
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