DocumentCode :
61110
Title :
High-Resolution THz Transmission and Reflection Measurements and Consequent Understanding of Resonant Hole-Arrays
Author :
Yuping Yang ; Grischkowsky, Daniel Richard
Author_Institution :
Sch. of Sci., Minzu Univ. of China, Beijing, China
Volume :
3
Issue :
2
fYear :
2013
fDate :
Mar-13
Firstpage :
151
Lastpage :
157
Abstract :
We report high-resolution THz-TDS characterization of the transmission and reflection of a thin metal hole-array in optical contact with a 10 mm thick high-resistivity Si plate. It was found that the red-shift of the [±1, 0] spoof surface-plasmon (SSP) transmission peak from the Wood´s anomaly valley indicates the coupling strength of the SSP wave to the metal surface due to the filling factor and shape of the holes, and that the red-shift provides a measurement of the SSP wave velocity. Our measurements of the amplitude transmission peak, and the corresponding reflection dip, of the hole-array agreed with numerical simulation to an accuracy of ±2 GHz, and the measured phase was in good agreement with simulation. However, our reflection measurements showed a second unexplained dip at the frequency of Wood´s anomaly.
Keywords :
electromagnetic wave reflection; electromagnetic wave transmission; numerical analysis; red shift; silicon; surface plasmons; terahertz waves; SSP wave velocity; Si; Wood anomaly valley; amplitude transmission peak; coupling strength; filling factor; high-resistivity Si plate; high-resolution THz transmission; high-resolution THz-TDS characterization; metal surface; numerical simulation; optical contact; red-shift; reflection dip; reflection measurements; resonant hole-arrays; size 10 mm; surface-plasmon transmission wave; thin metal hole-array; Frequency measurement; Metals; Optical surface waves; Phase measurement; Plasmons; Silicon; Surface waves; Hole-arrays; THz-TDS; spoof surface plasmons; surface plasmons;
fLanguage :
English
Journal_Title :
Terahertz Science and Technology, IEEE Transactions on
Publisher :
ieee
ISSN :
2156-342X
Type :
jour
DOI :
10.1109/TTHZ.2013.2241426
Filename :
6464563
Link To Document :
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