D-band grid-array antenna integrated in the lid of a surface-mountable chip-package

Author

Beer, Sebastian ; Rusch, Christian ; Gottel, B. ; Gulan, Heiko ; Zwick, T.

Author_Institution

Inst. fuer Hochfrequenztech. und Elektron. (IHE), Karlsruhe, Germany

fYear

2013

fDate

8-12 April 2013

Firstpage

1318

Lastpage

1322

Abstract

A packaging solution for single-chip millimeter-wave transceivers is presented. It integrates an antenna into the lid of the chip package. Multi-layer organic materials are used as antenna substrate. A prototype demonstrates the feasibility of the packaging process and the antenna performance. It consists of three parts: A package base; a MMIC dummy that allows measuring the antenna including the flip chip interconnect; and a 122-GHz grid array antenna. The complete antenna-in-package prototype is measured using a probe based measurement system.

Keywords

MMIC; flip-chip devices; millimetre wave antennas; radio transceivers; D-band grid-array antenna; MMIC dummy; antenna substrate; antenna-in-package prototype; flip chip interconnect; frequency 122 GHz; multilayer organic materials; package base; packaging solution; probe-based measurement system; single-chip millimeter-wave transceivers; surface-mountable chip-package lid; Antenna measurements; Antennas; MMICs; Packaging; Prototypes; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation (EuCAP), 2013 7th European Conference on

Conference_Location

Gothenburg

Print_ISBN

978-1-4673-2187-7

Electronic_ISBN

978-88-907018-1-8

Type

conf

Filename

6546491