DocumentCode :
61149
Title :
Fabrication and Characterization of a Suspended TCD Integrated With a Gas Separation Column
Author :
Narayanan, Shrikanth ; Agah, Masoud
Author_Institution :
Bradley Dept. of Electr. & Comput. Eng., Virginia Polytech. Inst. & State Univ., Blacksburg, VA, USA
Volume :
22
Issue :
5
fYear :
2013
fDate :
Oct. 2013
Firstpage :
1166
Lastpage :
1173
Abstract :
This paper reports the design, fabrication, and performance evaluation of a unique high aspect ratio resistor on glass employed in a micro thermal conductivity detector (μTCD). Finite-element simulations demonstrate significant improvements in power dissipation and warm-up time by suspending the resistors in the microchannels. Microfabrication techniques employed here enable dry release of 170 μm-diameter coil-shaped resistors on Borofloat in a two-mask process. The microfluidic channels on silicon wafers are independently processed using deep reactive ion etching and subsequently anodic bonded to the glass substrate harboring the TCD resistors. Experiments reveal that the suspended resistors need only 13 mW to reach 100 °C in less than 6 ms and could yield 200 ppm minimum detection limit. The completed chip containing a 1-m-long, 100- μm-wide column with embedded TCD resistors occupies an area of 2.5 × 2 cm. The column coated with an OV-1 stationary phase using the static coating method successfully separated a mixture of hydrocarbons, while the TCD resistors connected in a Wheatstone configuration were able to generate the chromatogram verified by that produced by a commercial flame ionization detector.
Keywords :
distillation equipment; finite element analysis; ionisation; masks; microchannel flow; microfabrication; microsensors; silicon; sputter etching; thermal conductivity; μTCD; Borofloat; OV-1 stationary phase; TCD resistors; Wheatstone configuration; coil-shaped resistors; commercial flame ionization detector; deep reactive ion etching; finite-element simulations; gas separation column; glass substrate; high aspect ratio resistor; hydrocarbons; micro thermal conductivity detector; microchannels; microfabrication techniques; microfluidic channels; power dissipation; silicon wafers; size 170 mum; static coating method; suspended TCD; two-mask process; warm-up time; Dry released resistor; micro-gas chromatography; monolithic MEMS integration; thermal conductivity detector;
fLanguage :
English
Journal_Title :
Microelectromechanical Systems, Journal of
Publisher :
ieee
ISSN :
1057-7157
Type :
jour
DOI :
10.1109/JMEMS.2013.2255117
Filename :
6516081
Link To Document :
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