Silicon microlens antenna for multi-pixel THz heterodyne detector arrays

Author

Choonsup Lee ; Chattopadhyay, Goutam ; Jung, Cheolkon ; Reck, Theodore ; Cooper, Ken ; Peralta, A. ; Lin, Richard ; Mehdi, Imran ; del Pino, M.A. ; Juan, N.L.

Author_Institution

Jet Propulsion Lab., NASA, Pasadena, CA, USA

fYear

2013

fDate

8-12 April 2013

Firstpage

1745

Lastpage

1746

Abstract

Silicon micromachined RF passive components such as washers, waveguide with 90 degree bends for 325-500 GHz band, and silicon-stacked blocks for W-band (75-110 GHz) GaAs power amplifiers have been designed, microfabricated, and characterized. Based on these results, we have successfully stacked several silicon micromachined wafers in order to build a Receiver-On-a-Chip (ROC) at 560 GHz. To the authors´ knowledge, this is the first demonstration of an all integrated silicon micromachined receiver front-end at submillimeter wavelengths. In addition, we have developed silicon microlens antenna which is compatible with the current silicon micromachined ROC. We have also developed wafer-level microlens microfabrication technique.

Keywords

III-V semiconductors; elemental semiconductors; gallium arsenide; heterodyne detection; lens antennas; micromachining; millimetre wave detectors; millimetre wave power amplifiers; silicon; terahertz wave detectors; waveguides; GaAs; Si; W-band; frequency 325 GHz to 500 GHz; frequency 75 GHz to 110 GHz; integrated silicon micromachined receiver front-end; multipixel THz heterodyne detector arrays; power amplifiers; silicon microlens antenna; silicon micromachined RF passive components; silicon micromachined wafers; silicon-stacked blocks; submillimeter wavelengths; wafer-level microlens microfabrication technique; washers; waveguide; Antenna arrays; Horn antennas; Lenses; Micromachining; Microoptics; Receivers; Silicon; THz; detector; silicon antenna; silicon micromachining;

fLanguage

English

Publisher

ieee

Conference_Titel

Antennas and Propagation (EuCAP), 2013 7th European Conference on

Conference_Location

Gothenburg

Print_ISBN

978-1-4673-2187-7

Electronic_ISBN

978-88-907018-1-8

Type

conf

Filename

6546579