• DocumentCode
    613553
  • Title

    An indirect technique for estimating reliability of analog and mixed-signal systems during operational life

  • Author

    Khan, Muhammad Asad ; Kerkhoff, Hans G.

  • Author_Institution
    Testable Design & Test of Integrated Syst. (TDT) Group, Univ. of Twente, Enschede, Netherlands
  • fYear
    2013
  • fDate
    8-10 April 2013
  • Firstpage
    159
  • Lastpage
    164
  • Abstract
    Reliability of electronic systems has been thoroughly investigated in literature and a number of analytical approaches at the design stage are already available via examination of the circuit-level reliability effects based on device-level models. Reliability estimation during operational life of an electronic system still lacks a solution especially for analog and mixed signal systems. The current work will present a novel technique for indirectly estimating reliability during operational life of an electronic system. Reliability simulations during the design stage of a potential critical performance parameter, sensitive to aging effects, over a range of input-stress voltages and working-stress temperatures have been used to generate a set of degradation values per unit time. These values are then used at the system level to estimate the degradation in that particular performance parameter and hence system reliability by regularly monitoring the input-stress voltages and working-stress temperatures. The simulation results conducted for an example target system in a LabVIEW environment show that the proposed technique is viable.
  • Keywords
    ageing; analogue integrated circuits; integrated circuit reliability; mixed analogue-digital integrated circuits; LabVIEW environment; aging effects; analog circuit; circuit-level reliability effects; device-level models; electronic system reliability; indirect technique; input-stress voltages; mixed-signal systems; operational life; potential critical performance parameter; reliability estimation; reliability simulations; working-stress temperatures; Aging; Degradation; Estimation; Monitoring; Reliability engineering; Stress; input signal monitoring; offset voltage; reliability; temperature monitoring; time before failure;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design and Diagnostics of Electronic Circuits & Systems (DDECS), 2013 IEEE 16th International Symposium on
  • Conference_Location
    Karlovy Vary
  • Print_ISBN
    978-1-4673-6135-4
  • Electronic_ISBN
    978-1-4673-6134-7
  • Type

    conf

  • DOI
    10.1109/DDECS.2013.6549809
  • Filename
    6549809