Lumped elements model for substrate noise coupling

A new lumped elements model for substrate parasitics in integrated circuits is introduced. The new model depends on frequency, contact´s size, separation between contacts, and substrate conductivity. The model consists of four lumped elements that are evaluated using few numbers of simulations and curve fitting steps. A closed form expression has been provided for each lumped element. By evaluating these expressions, the model is used for any spacing distance between the aggressor contact and the victim one for arbitrary contact size. The introduced model shows very good agreement (<; 5% error) when compared against electromagnetic field solver simulations over frequency ranges up to 30GHz.