• DocumentCode
    614975
  • Title

    Leveraging applied materials TechEdge Prizm™ for advanced lithography process control

  • Author

    Llanos, Paul ; Cornell, Roger

  • Author_Institution
    Adv. Software Services, Appl. Mater., Hopewell Junction, VA, USA
  • fYear
    2013
  • fDate
    14-16 May 2013
  • Firstpage
    256
  • Lastpage
    261
  • Abstract
    Presently the CDSEM metrology tool continues to be the “ruler of the fab” providing metrology at over 100 steps along the way to building a modern semiconductor product. We explore the history of data volume generated with Fab CDSEM fleets. As we quantify the size of the fleet dataset, it becomes clear why historically only a subset of the rich dataset is ever utilized. We review what the treatment of the data using modern “big data” analytics and enterprise level server hardware does to accelerate development learning, increase engineering turns per day and raise the velocity of accurate manufacturing feedback. This paper further explores ways to leverage TechEdge Prizm to extract more value out of metrology for Lithography process control. The paper will describe some of the challenges facing the changing Lithography metrology landscape and how Prizm delivers tailored analysis for these challenges. Results at a customer site demonstrate that various types of analysis of CDSEM images and data are 10 times more efficient and thorough than traditional methods.
  • Keywords
    lithography; process control; semiconductor device manufacture; CDSEM fleets; CDSEM metrology tool; TechEdge Prizm; applied materials; enterprise level server hardware; fleet dataset; lithography metrology landscape; lithography process control; manufacturing feedback; semiconductor product; Big data; Lithography; Metrology; Pattern recognition; Process control; Semiconductor device measurement; CDSEM; Data mining; Lithography; Metrology;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Advanced Semiconductor Manufacturing Conference (ASMC), 2013 24th Annual SEMI
  • Conference_Location
    Saratoga Springs, NY
  • ISSN
    1078-8743
  • Print_ISBN
    978-1-4673-5006-8
  • Type

    conf

  • DOI
    10.1109/ASMC.2013.6552814
  • Filename
    6552814