DocumentCode
614975
Title
Leveraging applied materials TechEdge Prizm™ for advanced lithography process control
Author
Llanos, Paul ; Cornell, Roger
Author_Institution
Adv. Software Services, Appl. Mater., Hopewell Junction, VA, USA
fYear
2013
fDate
14-16 May 2013
Firstpage
256
Lastpage
261
Abstract
Presently the CDSEM metrology tool continues to be the “ruler of the fab” providing metrology at over 100 steps along the way to building a modern semiconductor product. We explore the history of data volume generated with Fab CDSEM fleets. As we quantify the size of the fleet dataset, it becomes clear why historically only a subset of the rich dataset is ever utilized. We review what the treatment of the data using modern “big data” analytics and enterprise level server hardware does to accelerate development learning, increase engineering turns per day and raise the velocity of accurate manufacturing feedback. This paper further explores ways to leverage TechEdge Prizm to extract more value out of metrology for Lithography process control. The paper will describe some of the challenges facing the changing Lithography metrology landscape and how Prizm delivers tailored analysis for these challenges. Results at a customer site demonstrate that various types of analysis of CDSEM images and data are 10 times more efficient and thorough than traditional methods.
Keywords
lithography; process control; semiconductor device manufacture; CDSEM fleets; CDSEM metrology tool; TechEdge Prizm; applied materials; enterprise level server hardware; fleet dataset; lithography metrology landscape; lithography process control; manufacturing feedback; semiconductor product; Big data; Lithography; Metrology; Pattern recognition; Process control; Semiconductor device measurement; CDSEM; Data mining; Lithography; Metrology;
fLanguage
English
Publisher
ieee
Conference_Titel
Advanced Semiconductor Manufacturing Conference (ASMC), 2013 24th Annual SEMI
Conference_Location
Saratoga Springs, NY
ISSN
1078-8743
Print_ISBN
978-1-4673-5006-8
Type
conf
DOI
10.1109/ASMC.2013.6552814
Filename
6552814
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