• DocumentCode
    614995
  • Title

    A compact 10×10 Gbps transmitter module based on a low cost 3D stacking solution

  • Author

    Raz, Oded ; Duan, Pinxiang ; Dorrestein, S. ; Williams, K.A. ; Molin, D. ; Sillard, P. ; Kraemer, F. ; Smalbrugge, B.E. ; Kuyt, G. ; Christensen, S.B. ; Lysdal, H. ; Duis, Jeroen ; Dorren, H.J.S.

  • Author_Institution
    TU/e, Eindhoven, Netherlands
  • fYear
    2013
  • fDate
    5-8 May 2013
  • Firstpage
    11
  • Lastpage
    12
  • Abstract
    We demonstrate a wafer-scale process for making compact 3D stacked 10×10 Gbps transmitter chips. Error-free operation is obtained for 0 and 500 meter transmission in OM4-Plus fiber with a maximum 1.4 dB Rx sensitivity penalty.
  • Keywords
    integrated optics; optical interconnections; optical transmitters; surface emitting lasers; OM4-Plus fiber; bit rate 10 Gbit/s; distance 0 m; distance 500 m; sensitivity penalty; vertical cavity surface emitting lasers; CMOS integrated circuits; Error-free operations; Optical fiber communication; Optical transmitters; Receivers; Three-dimensional displays; Vertical cavity surface emitting lasers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optical Interconnects Conference, 2013 IEEE
  • Conference_Location
    Santa Fe, NM
  • Print_ISBN
    978-1-4673-5061-7
  • Electronic_ISBN
    978-1-4673-5062-4
  • Type

    conf

  • DOI
    10.1109/OIC.2013.6552899
  • Filename
    6552899
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=614995