• DocumentCode
    614997
  • Title

    Packaging technology for embedded optical modules

  • Author

    Ahadian, J. ; Kusumoto, K. ; Bachta, Paul ; Wong, Man ; Pommer, D. ; Hagan, R. ; Lenos, H. ; Kuznia, C.

  • Author_Institution
    Ultra Commun., Inc., Vista, CA, USA
  • fYear
    2013
  • fDate
    5-8 May 2013
  • Firstpage
    15
  • Lastpage
    16
  • Abstract
    We present packaging technology for creating compact, high-data rate fiber optic components that are compatible with high-temperature operation and solder reflow board assembly. We describe the application of this technology for mid-board optical communications.
  • Keywords
    optical communication; optical fibre fabrication; reflow soldering; high-data rate fiber optic components; optical communications; optical modules; packaging technology; solder reflow board assembly; Arrays; Flip-chip devices; Lenses; Optical fibers; Packaging; Transceivers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Optical Interconnects Conference, 2013 IEEE
  • Conference_Location
    Santa Fe, NM
  • Print_ISBN
    978-1-4673-5061-7
  • Electronic_ISBN
    978-1-4673-5062-4
  • Type

    conf

  • DOI
    10.1109/OIC.2013.6552901
  • Filename
    6552901
    • Link To Document
    https://search.isc.ac/dl/search/defaultta.aspx?DTC=49&DC=614997