• DocumentCode
    615591
  • Title

    Tailoring of the electrical properties of silicon carbide for field grading application

  • Author

    Vanga-Bouanga, C. ; Heid, Thomas F. ; David, E. ; Frechette, M.F. ; Savoie, S.

  • Author_Institution
    Ecole de Technol. Super. (ETS), Montréal, QC, Canada
  • fYear
    2013
  • fDate
    2-5 June 2013
  • Firstpage
    263
  • Lastpage
    266
  • Abstract
    This paper reports on the results of a numerical modeling that considers the field grading phenomena of SiC powder with a variable resistivity dependent on particle size. The particle shape and size of commercially available SiC powders were altered by ball milling. In an earlier work, we have determined the electrical properties of various SiC powders by using a controlled-pressure Ohmmeter. Different pressures were applied to improve the particle-to-particle contacts. The highvoltage resistivity measurements were done by ramping a DC voltage at a rate of 5 V/s up to 2500 V and monitoring the current. Milling of the original powder for 30 minutes was performed, resulting in a decrease of the average particle size from 50.6 μm to 2.06 μm (median of the volume distribution). This led to a resistivity increase from 0.38 to 52 MΩ.cm under an applied pressure of 21 MPa. All materials have shown non-linear electrical behavior.
  • Keywords
    ball milling; numerical analysis; powders; silicon compounds; wide band gap semiconductors; DC voltage; Ohmmeter; SiC; ball milling; electrical properties; field grading; highvoltage resistivity measurements; numerical modeling; particle shape; particle size; particle-to-particle contacts; powder milling; pressure 21 MPa; resistance 0.38 Mohm to 52 Mohm; time 30 min; voltage 2500 V; wavelength 50.6 mum to 2.06 mum; Conductivity; Electric potential; Materials; Milling; Powders; Silicon carbide; Stress; SiC powder; ball milling; electrical field grading; electrical properties; resistivity;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electrical Insulation Conference (EIC), 2013 IEEE
  • Conference_Location
    Ottawa, ON
  • Print_ISBN
    978-1-4673-4738-9
  • Electronic_ISBN
    978-1-4673-4739-6
  • Type

    conf

  • DOI
    10.1109/EIC.2013.6554246
  • Filename
    6554246