• DocumentCode
    618302
  • Title

    Peak noise and noise width modelling for RLC global interconnects in deep submicron VLSI circuits

  • Author

    Maheshwari, V. ; Khare, Kavita ; Mukherjee, Sayan ; Kar, Rajib ; Mandal, Durbadal

  • Author_Institution
    Deptt. of ECE, Apeejay Stya Univ., Gurgaon, India
  • fYear
    2013
  • fDate
    11-12 April 2013
  • Firstpage
    321
  • Lastpage
    326
  • Abstract
    This paper presents a new method to estimate the crosstalk noise for on-chip VLSI RLC global interconnects using 2-π model. Distributed RLC on-chip global interconnects can be modelled for an above low frequency operation with sufficient accuracy and better result. To calculate this crosstalk noise we apply the unit step input to the aggressor network side which is adjacent to the victim network. This proposed model presents the noise voltage waveform by using 2-π model. This noise voltage generated at the output of the victim network. This paper also gives the idea of peak crosstalk noise amplitude and noise width for on-chip global RLC VLSI interconnects. Some mathematical technique are using for calculating the peak noise amplitude and noise width for RLC interconnect. The dominant pole method is best one because this method reduces the complexity of the transfer function of complex electrical network. So, the finally we get average error of less than 6% when compared to that of the SPICE simulation. So, this is the better technique to use than the SPICE result.
  • Keywords
    RLC circuits; VLSI; integrated circuit interconnections; integrated circuit noise; transfer functions; waveform analysis; 2-π model; aggressor network; complex electrical network; crosstalk noise estimation method; deep submicron VLSI circuits; distributed RLC on-chip global interconnects; dominant pole method; low frequency operation; mathematical technique; noise voltage waveform; noise width modelling; on-chip VLSI RLC global interconnects; peak crosstalk noise amplitude; peak noise amplitude calculation; transfer function complexity reduction; victim network; Couplings; Crosstalk; Integrated circuit interconnections; Integrated circuit modeling; Noise; SPICE; Very large scale integration; Crosstalk; Noise Modelling; On-Chip RLC Interconnect; Unit step Input;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Information & Communication Technologies (ICT), 2013 IEEE Conference on
  • Conference_Location
    JeJu Island
  • Print_ISBN
    978-1-4673-5759-3
  • Type

    conf

  • DOI
    10.1109/CICT.2013.6558113
  • Filename
    6558113