DocumentCode
618649
Title
DRIE process modelling — A MEMS case study on a real design
Author
Pagazani, Julien ; Marty, Frederic ; Babayan, A. ; Hoessinger, A. ; Lissorgues, Gaelle ; Nejim, Ahmed
Author_Institution
CNAM, Univ. Paris-Est, Noisy le Grand, France
fYear
2013
fDate
16-18 April 2013
Firstpage
1
Lastpage
3
Abstract
The aim of this work is to model accurately the DRIE Bosch process used for the MEMS components fabrication. This modelling will permit, depending on the design, to obtain a 3D visualization of the substrate after etching and therefore foresee the real MEMS profile. Another objective is to determine, depending on the modelling accuracy, some process parameters which have been used on the etching equipment to reach such a 3D profile.
Keywords
micromechanical devices; sputter etching; 3D visualization; DRIE Bosch process; DRIE process modelling; MEMS components fabrication; deep reactive ion etching; etching equipment; substrate; Etching; Fingers; Ions; Micromechanical devices; Silicon; Solid modeling; Substrates; Bosch process; DRIE; MEMS; Micro-fabrication; Process Modelling;
fLanguage
English
Publisher
ieee
Conference_Titel
Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2013 Symposium on
Conference_Location
Barcelona
Print_ISBN
978-1-4673-4477-7
Type
conf
Filename
6559434
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