• DocumentCode
    618656
  • Title

    Active control of effective mass, damping and stiffness of MEMS

  • Author

    Sayed, Shehrin ; Clark, Jason Vaughn

  • Author_Institution
    Birck Nanotechnol. Center, Purdue Univ., West Lafayette, IN, USA
  • fYear
    2013
  • fDate
    16-18 April 2013
  • Firstpage
    1
  • Lastpage
    7
  • Abstract
    We propose the active control of effective stiffness, damping, and mass of MEMS by applying feedback forces that are proportional to displacement, velocity, and acceleration of its proof mass. Such control in performance is important due to the systemic variation in performance caused by process variations, packaging stresses, thermal drift, energy losses, and noise sources. Prior efforts by others have used feedback forces based on position or velocity to modify bandwidth, frequency, quality factor, and the sensitivity of resonators. What is different about our study is that it explores comprehensive control over the effective mass, damping, and stiffness simultaneously. Electrical emulations of mass, damping, and stiffness may be positive or negative, and they can be larger than their purely mechanical counterparts. We provide an analytical derivation for steady-state analysis numerical results for transient analysis. Our steady-state analysis includes signal delay, and transient simulations include both delay and noise. We find that changes in effective mass and stiffness can be increased by an order of magnitude, and damping can be increased by three orders of magnitude.
  • Keywords
    acceleration control; damping; elasticity; electronics packaging; feedback; force control; losses; micromechanical resonators; micropositioning; numerical analysis; velocity control; MEMS; acceleration control; damping control; displacement control; electrical emulation; energy loss; feedback force control; mass control; noise source; numerical analysis; packaging stress; position control; process variation; quality factor; resonator; signal delay; steady-state analysis; stiffness control; thermal drift; transient analysis; transient simulation; velocity control; Acceleration; Damping; Delays; Force; Micromechanical devices; Noise; Resonant frequency; Circuit Delay; Dynamical control; Effective Damping; Effective Mass; Effective Stiffness; Electrostatic Feedback Force; Noise;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Design, Test, Integration and Packaging of MEMS/MOEMS (DTIP), 2013 Symposium on
  • Conference_Location
    Barcelona
  • Print_ISBN
    978-1-4673-4477-7
  • Type

    conf

  • Filename
    6559441