DocumentCode :
618907
Title :
Mechanical characterization of nanowires by planar vibration sensor
Author :
Zhang, Leiqi ; Lu, Jun ; Takagi, Hiroyuki ; Maeda, Ryutaro
Author_Institution :
Res. Center for Ubiquitous MEMS & Micro Eng. (UMEMSME), Nat. Inst. of Adv. Ind. Sci. & Technol. (AIST), Tsukuba, Japan
fYear :
2013
fDate :
7-10 April 2013
Firstpage :
124
Lastpage :
127
Abstract :
Nanowires have attracted considerable interest as the nanoscale interconnects and as the moving elements of both electronic and electromechanical devices. The evaluation of nanomechanical property plays a significant role in the development of new nanowire-based devices. Recently, we are engaged in developing an easy method for nanomechanical measurement by using an in-plane-mode piezoresistive vibration sensor fabricated with less process cost and package difficulties. Theoretical analysis and simulation results suggested that the device is capable of high-sensitive and variety, and it is expected to evaluate mechanical properties of metallic or metallic oxide nanowires.
Keywords :
fracture toughness testing; interconnections; nanoelectromechanical devices; nanoelectronics; nanomechanics; nanowires; piezoresistive devices; sensors; vibration measurement; electromechanical devices; electronic devices; in-plane-mode piezoresistive vibration sensor; mechanical characterization; metallic nanowires; metallic oxide nanowires; moving elements; nanomechanical measurement; nanomechanical property; nanoscale interconnects; nanowire-based devices; planar vibration sensor; Bonding; Nanowires; Silicon; Substrates; Testing; Vibrations; MEMS; Mechanical Property; Nanowire; Planar Vibration Sensor;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on
Conference_Location :
Suzhou
Electronic_ISBN :
978-1-4673-6351-8
Type :
conf
DOI :
10.1109/NEMS.2013.6559696
Filename :
6559696
Link To Document :
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