DocumentCode
618907
Title
Mechanical characterization of nanowires by planar vibration sensor
Author
Zhang, Leiqi ; Lu, Jun ; Takagi, Hiroyuki ; Maeda, Ryutaro
Author_Institution
Res. Center for Ubiquitous MEMS & Micro Eng. (UMEMSME), Nat. Inst. of Adv. Ind. Sci. & Technol. (AIST), Tsukuba, Japan
fYear
2013
fDate
7-10 April 2013
Firstpage
124
Lastpage
127
Abstract
Nanowires have attracted considerable interest as the nanoscale interconnects and as the moving elements of both electronic and electromechanical devices. The evaluation of nanomechanical property plays a significant role in the development of new nanowire-based devices. Recently, we are engaged in developing an easy method for nanomechanical measurement by using an in-plane-mode piezoresistive vibration sensor fabricated with less process cost and package difficulties. Theoretical analysis and simulation results suggested that the device is capable of high-sensitive and variety, and it is expected to evaluate mechanical properties of metallic or metallic oxide nanowires.
Keywords
fracture toughness testing; interconnections; nanoelectromechanical devices; nanoelectronics; nanomechanics; nanowires; piezoresistive devices; sensors; vibration measurement; electromechanical devices; electronic devices; in-plane-mode piezoresistive vibration sensor; mechanical characterization; metallic nanowires; metallic oxide nanowires; moving elements; nanomechanical measurement; nanomechanical property; nanoscale interconnects; nanowire-based devices; planar vibration sensor; Bonding; Nanowires; Silicon; Substrates; Testing; Vibrations; MEMS; Mechanical Property; Nanowire; Planar Vibration Sensor;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on
Conference_Location
Suzhou
Electronic_ISBN
978-1-4673-6351-8
Type
conf
DOI
10.1109/NEMS.2013.6559696
Filename
6559696
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