DocumentCode
618965
Title
Surface property study of different patterning sapphire structures by ICP-RIE
Author
Chun-Ming Chang ; Ming-Hua Shiao ; Donyau Chiang ; Mao-Jung Huang ; Chin-Tien Yang ; Wen-Jeng Hsueh
Author_Institution
Instrum. Technol. Res. Center, Nat. Appl. Res. Labs., Hsinchu, Taiwan
fYear
2013
fDate
7-10 April 2013
Firstpage
372
Lastpage
375
Abstract
In this paper, we demonstrate and compare the formation of ordered etching masks for submicron patterned sapphire through use of the nanosphere lithography and nanoimprint lithography methods. Both NSL and NIL were applied to produce the submicron honeycomb network and cone protrusion array structure on the sapphire surface as etching masks. The sequent ICP-RIE technique was applied to further etch the sapphire under the mask. Two types of submicron pattern were obtained on the substrate surface after the etching processes were completed. One type of substrate was the submicron hole array structure and another type was the cone array structure. The working pressure had a considerable effect on the shape geometry and etching rate. The contact angles of the untreated substrate and two differing patterned sapphire substrates were measured and compared. From the contact angle measurement results, we concluded that the protruded contact area dominated the hydrophobic or hydrophilic property.
Keywords
contact angle; nanofabrication; nanolithography; plasma materials processing; sapphire; sputter etching; Al2O3; ICP-RIE; NIL; NSL; cone protrusion array structure; contact angle; inductively coupled plasma reactive ion etching; nanoimprint lithography methods; nanosphere lithography; ordered etching masks; submicron hole array structure; submicron honeycomb network; submicron patterned sapphire; Arrays; Etching; Nanostructures; Polymers; Substrates; Surface morphology; formatting; style; styling;
fLanguage
English
Publisher
ieee
Conference_Titel
Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on
Conference_Location
Suzhou
Electronic_ISBN
978-1-4673-6351-8
Type
conf
DOI
10.1109/NEMS.2013.6559754
Filename
6559754
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