• DocumentCode
    618965
  • Title

    Surface property study of different patterning sapphire structures by ICP-RIE

  • Author

    Chun-Ming Chang ; Ming-Hua Shiao ; Donyau Chiang ; Mao-Jung Huang ; Chin-Tien Yang ; Wen-Jeng Hsueh

  • Author_Institution
    Instrum. Technol. Res. Center, Nat. Appl. Res. Labs., Hsinchu, Taiwan
  • fYear
    2013
  • fDate
    7-10 April 2013
  • Firstpage
    372
  • Lastpage
    375
  • Abstract
    In this paper, we demonstrate and compare the formation of ordered etching masks for submicron patterned sapphire through use of the nanosphere lithography and nanoimprint lithography methods. Both NSL and NIL were applied to produce the submicron honeycomb network and cone protrusion array structure on the sapphire surface as etching masks. The sequent ICP-RIE technique was applied to further etch the sapphire under the mask. Two types of submicron pattern were obtained on the substrate surface after the etching processes were completed. One type of substrate was the submicron hole array structure and another type was the cone array structure. The working pressure had a considerable effect on the shape geometry and etching rate. The contact angles of the untreated substrate and two differing patterned sapphire substrates were measured and compared. From the contact angle measurement results, we concluded that the protruded contact area dominated the hydrophobic or hydrophilic property.
  • Keywords
    contact angle; nanofabrication; nanolithography; plasma materials processing; sapphire; sputter etching; Al2O3; ICP-RIE; NIL; NSL; cone protrusion array structure; contact angle; inductively coupled plasma reactive ion etching; nanoimprint lithography methods; nanosphere lithography; ordered etching masks; submicron hole array structure; submicron honeycomb network; submicron patterned sapphire; Arrays; Etching; Nanostructures; Polymers; Substrates; Surface morphology; formatting; style; styling;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on
  • Conference_Location
    Suzhou
  • Electronic_ISBN
    978-1-4673-6351-8
  • Type

    conf

  • DOI
    10.1109/NEMS.2013.6559754
  • Filename
    6559754