Undercut edges for robust capillary self-alignment in hybrid microassembly

Author

Liimatainen, Ville ; Sariola, Veikko ; Quan Zhou

Author_Institution

Dept. of Autom. & Syst. Technol., Aalto Univ., Aalto, Finland

fYear

2013

fDate

7-10 April 2013

Firstpage

1088

Lastpage

1091

Abstract

In this paper, we report capillary self-alignment of 200 ×x 200 μm square parts on matching patterns with undercut edges. The undercut edge structure is a purely topographical feature that provides ultimate pinning for liquids of any surface tension without chemical treatment. We show contact angles close to 180° for low surface tension liquids, and capillary self-alignment using thermally curable adhesive. Submicron alignment accuracy after adhesive curing is verified in a scanning electron microscope (SEM).

Keywords

adhesives; contact angle; curing; microassembling; microfabrication; scanning electron microscopy; surface tension; SEM; contact angles; hybrid microassembly; low-surface tension liquid; matching patterns; robust capillary self-alignment; scanning electron microscope; submicron alignment accuracy; surface tension; thermally-curable adhesive; topographical feature; undercut edge structure; Accuracy; Image edge detection; Liquids; Microscopy; Silicon; Surface tension; Surface treatment; microassembly; microfabrication; self-alignment; surface tension; wetting;

fLanguage

English

Publisher

ieee

Conference_Titel

Nano/Micro Engineered and Molecular Systems (NEMS), 2013 8th IEEE International Conference on

Conference_Location

Suzhou

Electronic_ISBN

978-1-4673-6351-8

Type

conf

DOI

10.1109/NEMS.2013.6559911

Filename

6559911