• DocumentCode
    620700
  • Title

    Scandium aluminum nitride: Highly piezoelectric thin film for RF SAW devices in multi GHz range

  • Author

    Teshigahara, Akihiko ; Hashimoto, Ken-ya ; Akiyama, Masanori

  • Author_Institution
    Res. Labs., Denso Corp., Nisshin, Japan
  • fYear
    2012
  • fDate
    7-10 Oct. 2012
  • Firstpage
    1
  • Lastpage
    5
  • Abstract
    This paper describes the preparation, characterization and application of scandium doped aluminum nitride (ScAIN) thin film. First, ScAIN thin film is deposited using dual co-sputtering technique. The piezolectric coefficient d33 of the film increases as the scandium concentration in the film increases and reaches a value approximately five times larger than that of AIN. Next, the high temperature durability of the film is shown by the changelessness of piezoelectric coefficient after heat treatment of approximately 1,000°C. Then, surface acoustic wave (SAW) devices are fabricated using a ScAIN/6Hsilicon carbide (6H-SiC) structure, and it is shown that the structure offers large Vand K2, while possessing very small SAW attenuation even in the multi GHz range.
  • Keywords
    aluminium compounds; hydrogen compounds; piezoelectric thin films; scandium compounds; silicon compounds; sputtering; surface acoustic wave devices; 6H silicon carbide; H-SiC; SAW devices; ScAIN 6H-SiC structure; ScAIN thin film; ScAlN; dual cosputtering technique; high temperature durability; piezolectric coefficient; scandium doped aluminum nitride; surface acoustic wave; Heating; Magnetic resonance imaging; Magnetic semiconductors; Nitrogen; Semiconductor device measurement; Surface acoustic waves;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2012 IEEE International
  • Conference_Location
    Dresden
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4673-4561-3
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2012.0481
  • Filename
    6561962