DocumentCode
620700
Title
Scandium aluminum nitride: Highly piezoelectric thin film for RF SAW devices in multi GHz range
Author
Teshigahara, Akihiko ; Hashimoto, Ken-ya ; Akiyama, Masanori
Author_Institution
Res. Labs., Denso Corp., Nisshin, Japan
fYear
2012
fDate
7-10 Oct. 2012
Firstpage
1
Lastpage
5
Abstract
This paper describes the preparation, characterization and application of scandium doped aluminum nitride (ScAIN) thin film. First, ScAIN thin film is deposited using dual co-sputtering technique. The piezolectric coefficient d33 of the film increases as the scandium concentration in the film increases and reaches a value approximately five times larger than that of AIN. Next, the high temperature durability of the film is shown by the changelessness of piezoelectric coefficient after heat treatment of approximately 1,000°C. Then, surface acoustic wave (SAW) devices are fabricated using a ScAIN/6Hsilicon carbide (6H-SiC) structure, and it is shown that the structure offers large Vand K2, while possessing very small SAW attenuation even in the multi GHz range.
Keywords
aluminium compounds; hydrogen compounds; piezoelectric thin films; scandium compounds; silicon compounds; sputtering; surface acoustic wave devices; 6H silicon carbide; H-SiC; SAW devices; ScAIN 6H-SiC structure; ScAIN thin film; ScAlN; dual cosputtering technique; high temperature durability; piezolectric coefficient; scandium doped aluminum nitride; surface acoustic wave; Heating; Magnetic resonance imaging; Magnetic semiconductors; Nitrogen; Semiconductor device measurement; Surface acoustic waves;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2012 IEEE International
Conference_Location
Dresden
ISSN
1948-5719
Print_ISBN
978-1-4673-4561-3
Type
conf
DOI
10.1109/ULTSYM.2012.0481
Filename
6561962
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