• DocumentCode
    620795
  • Title

    A casting-based fabrication process for a high-frequency piezo-electric linear array

  • Author

    van Dijk, Gerrit J. ; Alles, Erwin J. ; van Dongen, K.W.A.

  • Author_Institution
    Lab. of Acoust. Wavefield Imaging, Delft Univ. of Technol., Delft, Netherlands
  • fYear
    2012
  • fDate
    7-10 Oct. 2012
  • Firstpage
    1822
  • Lastpage
    1825
  • Abstract
    Novel ultrasound arrays used in medical imaging contain many small elements (down to 100 μm) operating at high frequencies (upto tens of MHz). In such arrays, each element requires an individual electrical connection. Typically, these connections are made to soldering pads located some distance away from the transducer, which in turn are connected to the element by a pathway on a printed circuit board. However, these pathways are unshielded and therefore sensitive to electromagnetic interference and cross-talk. In this work, a casting-based fabrication process is presented where the room required for electrical connections is created vertically, i.e., in the direction perpendicular to the transducer surface. Using this process, chambers are created into which the cores of coaxial cables are inserted, and on top of these chambers the elements are built. As only the part of the cables inserted into the chambers is unshielded, the sensitivity to electromagnetic interference is strongly reduced. In addition, the elements share a single ground electrode which acts as a Faraday cage and further reduces interference. Using this fabrication process, a linear array was constructed containing eight elements of dimensions 100 μm by 350 μm operating at a center frequency of 21 MHz. The array is validated both acoustically and mechanically, and is shown to consist of eight virtually identical elements exhibiting high fractional bandwidths of more than 80%. Virtually no mechanical crosstalk is observed.
  • Keywords
    casting; printed circuits; ultrasonic transducer arrays; Faraday cage; casting-based fabrication process; coaxial cables; cross-talk; electrical connection; electromagnetic interference; frequency 21 MHz; ground electrode; high-frequency piezo-electric linear array; medical imaging; printed circuit board; size 100 mum; size 350 mum; soldering pads; transducer surface; ultrasound arrays; Acoustics; Arrays; Coaxial cables; Electrodes; Electromagnetic interference; Fabrication; Transducers;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Ultrasonics Symposium (IUS), 2012 IEEE International
  • Conference_Location
    Dresden
  • ISSN
    1948-5719
  • Print_ISBN
    978-1-4673-4561-3
  • Type

    conf

  • DOI
    10.1109/ULTSYM.2012.0457
  • Filename
    6562158