DocumentCode
620795
Title
A casting-based fabrication process for a high-frequency piezo-electric linear array
Author
van Dijk, Gerrit J. ; Alles, Erwin J. ; van Dongen, K.W.A.
Author_Institution
Lab. of Acoust. Wavefield Imaging, Delft Univ. of Technol., Delft, Netherlands
fYear
2012
fDate
7-10 Oct. 2012
Firstpage
1822
Lastpage
1825
Abstract
Novel ultrasound arrays used in medical imaging contain many small elements (down to 100 μm) operating at high frequencies (upto tens of MHz). In such arrays, each element requires an individual electrical connection. Typically, these connections are made to soldering pads located some distance away from the transducer, which in turn are connected to the element by a pathway on a printed circuit board. However, these pathways are unshielded and therefore sensitive to electromagnetic interference and cross-talk. In this work, a casting-based fabrication process is presented where the room required for electrical connections is created vertically, i.e., in the direction perpendicular to the transducer surface. Using this process, chambers are created into which the cores of coaxial cables are inserted, and on top of these chambers the elements are built. As only the part of the cables inserted into the chambers is unshielded, the sensitivity to electromagnetic interference is strongly reduced. In addition, the elements share a single ground electrode which acts as a Faraday cage and further reduces interference. Using this fabrication process, a linear array was constructed containing eight elements of dimensions 100 μm by 350 μm operating at a center frequency of 21 MHz. The array is validated both acoustically and mechanically, and is shown to consist of eight virtually identical elements exhibiting high fractional bandwidths of more than 80%. Virtually no mechanical crosstalk is observed.
Keywords
casting; printed circuits; ultrasonic transducer arrays; Faraday cage; casting-based fabrication process; coaxial cables; cross-talk; electrical connection; electromagnetic interference; frequency 21 MHz; ground electrode; high-frequency piezo-electric linear array; medical imaging; printed circuit board; size 100 mum; size 350 mum; soldering pads; transducer surface; ultrasound arrays; Acoustics; Arrays; Coaxial cables; Electrodes; Electromagnetic interference; Fabrication; Transducers;
fLanguage
English
Publisher
ieee
Conference_Titel
Ultrasonics Symposium (IUS), 2012 IEEE International
Conference_Location
Dresden
ISSN
1948-5719
Print_ISBN
978-1-4673-4561-3
Type
conf
DOI
10.1109/ULTSYM.2012.0457
Filename
6562158
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