DocumentCode :
621075
Title :
35 nm mHEMT Technology for THz and ultra low noise applications
Author :
Leuther, A. ; Tessmann, A. ; Dammann, Michael ; Massler, Hermann ; Schlechtweg, Michael ; Ambacher, Oliver
Author_Institution :
Fraunhofer Inst. for Appl. Solid State Phys. (IAF), Freiburg, Germany
fYear :
2013
fDate :
19-23 May 2013
Firstpage :
1
Lastpage :
2
Abstract :
In this paper we present a very compact 0.28 × 0.55 mm2 six-stage terahertz monolithic integrated circuit (TMIC) using 35 nm gate length metamorphic high electron mobility transistors (mHEMTs). A linear gain of 20.3 dB at 610 GHz and more than 18 dB over the bandwidth from 557 to 616 GHz was achieved for a drain voltage Vd of only 0.6 V. The noise performance of the 35 nm mHEMT was investigated on the basis of a packaged H-band amplifier which achieved a small-signal gain of more than 20 dB between 220 and 300 GHz. The averaged measured noise figure was 6.1 dB which is to our knowledge the lowest published value of any MMIC technology in this frequency range. To determine the transistor reliability accelerated lifetime tests in air were done. Based on a 20 % gm_max degradation failure criterion a median time to failure of 1.8 × 105 h at a channel temperature of 75°C and VDS = 0.8 V was extrapolated
Keywords :
MMIC; high electron mobility transistors; integrated circuit noise; MMIC technology; bandwidth 557 GHz to 616 GHz; degradation failure criterion; drain voltage; frequency 610 GHz; frequency range; gain 20.3 dB; mHEMT technology; metamorphic high electron mobility transistor; noise figure; noise figure 6.1 dB; packaged H-band amplifier; size 35 nm; small signal gain; temperature 75 C; terahertz monolithic integrated circuit; transistor reliability; ultra low noise application; voltage 0.6 V; voltage 0.8 V; Frequency measurement; Gain; Logic gates; MMICs; Noise figure; mHEMTs;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Indium Phosphide and Related Materials (IPRM), 2013 International Conference on
Conference_Location :
Kobe
ISSN :
1092-8669
Print_ISBN :
978-1-4673-6130-9
Electronic_ISBN :
1092-8669
Type :
conf
DOI :
10.1109/ICIPRM.2013.6562647
Filename :
6562647
Link To Document :
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