Approach on the Life-Prediction of Solder Joint for Electronic Packaging Under Combined Loading

A life-prediction approach of solder joints for electronic packaging under combined loading is presented in this paper. The deformations of solder joints are calculated under vibration and thermal cycling loading based on the finite element method. The calculated results are used as the boundary condition of the multi-axial loading to investigate the strain and stress of the solder joints. Then the life of solder joints can be evaluated by using a linear damage superposition approach. The result reveals that the life of solder joints can be divided into three regions according to the vibration amplitude at the same temperature: the life of solder joints in the first region is affected by creep damage; the life of solder joints in the second region is greatly influenced by the combined loading damage; the life of solder joints in the third region is impacted by the fatigue damage. The trend of the simulation results approximately agrees with the experimental results of other researchers.