• DocumentCode
    624341
  • Title

    OCP: Offload Co-Processor for energy efficiency in embedded mobile systems

  • Author

    Jie Tang ; Chen Liu ; Yu-Liang Chou ; Shaoshan Liu

  • Author_Institution
    Intel, Beijing, China
  • fYear
    2013
  • fDate
    5-7 June 2013
  • Firstpage
    107
  • Lastpage
    110
  • Abstract
    In current embedded mobile systems design, the application processor (AP) is often woken up to service interrupts and user requests. However, this kind of wakeups from sleep is very expensive in terms of battery usage. In the observation that the operating system/driver workloads are very light-weight, in this paper we propose the Offload Co-Processor (OCP) SoC architecture. In the OCP SoC design, when the device is idle, we offload the operating system workloads (mainly interrupt handling workloads) to an ultra-low-power coprocessor. This way, the co-processor would be able to handle most wake-up requests without awakening the heavy-weight AP, thus avoiding the overhead of AP spin-up/down. Using GPS continuous sampling workload as a case study, we show that the proposed OCP SoC design would extend battery life by 3.5 folds.
  • Keywords
    coprocessors; mobile computing; operating systems (computers); power aware computing; system-on-chip; AP; GPS continuous sampling workload; OCP SoC architecture; OCP SoC design; SoC architecture; application processor; battery usage; embedded mobile systems design; energy efficiency; offload coprocessor; operating system driver workloads; operating system workloads; ultra low power coprocessor; Batteries; Energy efficiency; Global Positioning System; Mobile communication; Mobile handsets; Power demand; System-on-chip; Application Processor; Embedded Mobile System; Energy Aware Computing; GPS Continuous Sampling; Interrupt Service Routines; Offload Co-processor;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Application-Specific Systems, Architectures and Processors (ASAP), 2013 IEEE 24th International Conference on
  • Conference_Location
    Washington, DC
  • ISSN
    2160-0511
  • Print_ISBN
    978-1-4799-0494-5
  • Type

    conf

  • DOI
    10.1109/ASAP.2013.6567561
  • Filename
    6567561