DocumentCode
626255
Title
Validation of Finite Element Model (FEM) of Coplanar Electrodes Capacitive Sensing Using Microfluidic-based Sensor Device
Author
Rahman, Mohamad Faizal Abd ; Nawi, Mohd Norzaidi Mat ; Manaf, Asrulnizam Abd ; Arshad, Mohd Rizal ; Sidek, Othman
Author_Institution
Sch. of Electr. & Electron. Eng., Univ. Sains Malaysia, Nibong Tebal, Malaysia
fYear
2013
fDate
5-7 June 2013
Firstpage
409
Lastpage
413
Abstract
This work aims to validate the 2D Finite Element Model (FEM) for estimating the capacitance changes across a microchannel with coplanar electrodes configuration employed. Such electrodes configuration becomes popular in microfluidic-based application where the sensing activity occurs inside a microchannel. ANSYS 12.1 is used to built the 2D model of the structure. The work begin by building the FEM model to find the capacitance per unit length, C/l or C* of different combination of coplanar structures. The variation yields an error of less than 17% as compared to analytical equation with both models having the same trend of capacitance changes. Then, based on the theory of capacitance in parallel, both models are further verified experimentally using a fabricated sensor device that employs a selected structure combination. Comparing the FEM and analytical model to the experimental measurement, the result shows the error of 5% and 24% for both models, respectively.
Keywords
capacitive sensors; electrodes; estimation theory; finite element analysis; microchannel flow; microfabrication; microsensors; 2D finite element model; ANSYS 12.1; FEM; capacitance estimation theory; coplanar electrode capacitive sensing; experimental measurement; microchannel; microfabrication; microfluidic-based sensor device; Analytical models; Capacitance; Electrodes; Finite element analysis; Mathematical model; Microchannel; Sensors; Capacitive sensing; microfluidic; coplanar electrodes;
fLanguage
English
Publisher
ieee
Conference_Titel
Computational Intelligence, Communication Systems and Networks (CICSyN), 2013 Fifth International Conference on
Conference_Location
Madrid
Print_ISBN
978-1-4799-0587-4
Type
conf
DOI
10.1109/CICSYN.2013.77
Filename
6571400
Link To Document