• DocumentCode
    626462
  • Title

    Variable increment step based reconfigurable interleaver for multimode communication application

  • Author

    Liang Tang ; Ambrose, Jude Angelo ; Parameswaran, Sri

  • Author_Institution
    Sch. of Comput. Sci. & Eng., Univ. of New South Wales, Sydney, NSW, Australia
  • fYear
    2013
  • fDate
    19-23 May 2013
  • Firstpage
    73
  • Lastpage
    76
  • Abstract
    The need to integrate multiple wireless communication protocols into a single low-cost flexible hardware platform is prompted by the increasing number of emerging communication protocols and applications in modern embedded systems. The interleaving, one of the key components in the communication baseband, varies in differing communication protocols. A novel reconfigurable variable increment step (VIS) based interleaver is proposed for efficient multimode communication application. The proposed reconfigurable interleaver supports both block and convolutional interleaving, costs little in area, consumes less power compared to some other programmable solutions, and is sufficiently fast to satisfy even the most demanding of Software Defined Radio (SDR) applications. The proposed method is flexible (when compared to ASICs and some reconfigurable solutions) and suitable for mobile applications in terms of area, power consumption and throughput (when compared to FPGAs, processors and some other ASIC based reconfigurable proposals).
  • Keywords
    embedded systems; mobile radio; protocols; software radio; SDR applications; block interleaving; convolutional interleaving; embedded systems; low-cost flexible hardware platform; mobile applications; multimode communication application; power consumption; reconfigurable VIS based interleaver; software defined radio applications; variable increment step based reconfigurable interleaver; wireless communication protocols; Application specific integrated circuits; Delays; Field programmable gate arrays; Power demand; Protocols; Random access memory; Throughput;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
  • Conference_Location
    Beijing
  • ISSN
    0271-4302
  • Print_ISBN
    978-1-4673-5760-9
  • Type

    conf

  • DOI
    10.1109/ISCAS.2013.6571785
  • Filename
    6571785