DocumentCode
626462
Title
Variable increment step based reconfigurable interleaver for multimode communication application
Author
Liang Tang ; Ambrose, Jude Angelo ; Parameswaran, Sri
Author_Institution
Sch. of Comput. Sci. & Eng., Univ. of New South Wales, Sydney, NSW, Australia
fYear
2013
fDate
19-23 May 2013
Firstpage
73
Lastpage
76
Abstract
The need to integrate multiple wireless communication protocols into a single low-cost flexible hardware platform is prompted by the increasing number of emerging communication protocols and applications in modern embedded systems. The interleaving, one of the key components in the communication baseband, varies in differing communication protocols. A novel reconfigurable variable increment step (VIS) based interleaver is proposed for efficient multimode communication application. The proposed reconfigurable interleaver supports both block and convolutional interleaving, costs little in area, consumes less power compared to some other programmable solutions, and is sufficiently fast to satisfy even the most demanding of Software Defined Radio (SDR) applications. The proposed method is flexible (when compared to ASICs and some reconfigurable solutions) and suitable for mobile applications in terms of area, power consumption and throughput (when compared to FPGAs, processors and some other ASIC based reconfigurable proposals).
Keywords
embedded systems; mobile radio; protocols; software radio; SDR applications; block interleaving; convolutional interleaving; embedded systems; low-cost flexible hardware platform; mobile applications; multimode communication application; power consumption; reconfigurable VIS based interleaver; software defined radio applications; variable increment step based reconfigurable interleaver; wireless communication protocols; Application specific integrated circuits; Delays; Field programmable gate arrays; Power demand; Protocols; Random access memory; Throughput;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
Conference_Location
Beijing
ISSN
0271-4302
Print_ISBN
978-1-4673-5760-9
Type
conf
DOI
10.1109/ISCAS.2013.6571785
Filename
6571785
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