DocumentCode
626805
Title
Multiple-pulse dynamic stability and failure analysis of low-voltage 6T-SRAM bitcells in 28nm UTBB-FDSOI
Author
Akyel, Kaya Can ; Ciampolini, L. ; Thomas, O. ; Pelloux-Prayer, B. ; Kumar, Sudhakar ; Flatresse, Philippe ; Lecocq, Claire ; Ghibaudo, Gerard
Author_Institution
STMicroelectron., CCDS, Crolles, France
fYear
2013
fDate
19-23 May 2013
Firstpage
1452
Lastpage
1455
Abstract
This work investigates the effects of process variability on the dynamic stability of a 6-Transistor Static Random Access Memory bitcell manufactured in 28nm Ultra-Thin Body and Buried Oxide Fully-Depleted Silicon-On-Insulator (UTBB-FDSOI) technology node. The study is carried out for two different well architectures: single-well (peculiar to UTBB-FDSOI) and dual-well (like in standard CMOS), through Most-Probable Failure Point tracking methodology coupled with Importance Sampling. Different failure mechanisms appearing under different operating conditions are discussed. We show that the Read-After-Write failure criterion based on multiple Word-Line pulses is the most accurate way to evaluate bitcell failure rate and thus its yield under realistic dynamic conditions. The methodology exposed in this work is applied to demonstrate the superior properties of the single-well architecture.
Keywords
SRAM chips; circuit stability; failure analysis; importance sampling; silicon-on-insulator; UTBB-FDSOI technology node; dual-well; importance sampling; low-voltage 6T-SRAM bitcells; most-probable failure point tracking methodology; multiple word-line pulses; multiple-pulse dynamic stability; operating conditions; read-after-write failure criterion; single-well architecture; size 28 nm; standard CMOS; static random access memory; ultra-thin body and buried oxide fully-depleted silicon-on-insulator; Computer architecture; Failure analysis; Integrated circuit modeling; Monte Carlo methods; Random access memory; Stability criteria;
fLanguage
English
Publisher
ieee
Conference_Titel
Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
Conference_Location
Beijing
ISSN
0271-4302
Print_ISBN
978-1-4673-5760-9
Type
conf
DOI
10.1109/ISCAS.2013.6572130
Filename
6572130
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