DocumentCode :
627107
Title :
Design methodology for inductive power transfer systems targeting high power implantable devices
Author :
Ho Yan Leung ; McCormick, Daniel ; Budgett, David ; Hu, Aiguo Patrick
Author_Institution :
Auckland Bioeng. Inst., Univ. of Auckland, Auckland, New Zealand
fYear :
2013
fDate :
19-23 May 2013
Firstpage :
2787
Lastpage :
2791
Abstract :
Developing a resonant inductively powered system for implantable devices is difficult due to the constraints on the operating coupling range, power level, and size. It is not trivial to determine the suitable resonant topology, tuning capacitors, power transfer coils, and operating frequency. Often the system parameters, such as the operating frequency, are designed using nominal values or a trial and error approach. We present a detailed numerical model which included frequency dependent parameters to accurately model the resonant system of an inductive power system, so that unexpected characteristics that might be hidden through approximations will be revealed. A procedure based on numerical simulation in the frequency domain is proposed to determine the resonant topology and tuning capacitances for achieving maximum efficiency with a set of power transfer coils across the specified operating coupling and loading conditions. A wireless power supply has been designed using this methodology, which increased the power efficiency by 4% on average over the full operating conditions.
Keywords :
frequency-domain analysis; inductive power transmission; numerical analysis; power capacitors; power supply quality; frequency dependent parameters; frequency domain; high power implantable devices; inductive power system; inductive power transfer systems; numerical simulation; power transfer coils; resonant inductively powered system; resonant system; resonant topology; tuning capacitors; wireless power supply; Capacitors; Coils; Couplings; RLC circuits; Resonant frequency; Topology; Tuning;
fLanguage :
English
Publisher :
ieee
Conference_Titel :
Circuits and Systems (ISCAS), 2013 IEEE International Symposium on
Conference_Location :
Beijing
ISSN :
0271-4302
Print_ISBN :
978-1-4673-5760-9
Type :
conf
DOI :
10.1109/ISCAS.2013.6572457
Filename :
6572457
Link To Document :
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