• DocumentCode
    627643
  • Title

    Power electronics thermal packaging and reliability

  • Author

    McCluskey, F. Patrick ; Bar-Cohen, Avram

  • Author_Institution
    Dept. of Mech. Eng., Univ. of Maryland, College Park, MD, USA
  • fYear
    2013
  • fDate
    16-19 June 2013
  • Firstpage
    1
  • Lastpage
    168
  • Abstract
    Presents the power point presentations from the conference proceedings. Power electronics is the critical enabling technology at the intersection of renewable power generation, reliable power distribution and transmission, and efficient power utilization and storage. Issues of compact and high power density packaging, thermal management and reliability are the most important research areas for realizing the full potential of power electronics.
  • Keywords
    power consumption; power distribution reliability; power electronics; power transmission reliability; thermal management (packaging); compact power density packaging; high power density packaging; power distribution reliability; power electronics thermal packaging; power storage efficiency; power transmission reliability; power utilization efficiency; renewable power generation; thermal management; Awards activities; Conferences; Educational institutions; Electronic packaging thermal management; Packaging; Power electronics; Technological innovation;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Transportation Electrification Conference and Expo (ITEC), 2013 IEEE
  • Conference_Location
    Detroit, MI
  • Print_ISBN
    978-1-4799-0146-3
  • Type

    conf

  • DOI
    10.1109/ITEC.2013.6573464
  • Filename
    6573464