Title :
Two-level hierarchical fill-buffer for graphics rendering systems
Author_Institution :
Dept. of Comput. Sci. & Eng., Nat. Sun Yat-sen Univ., Kaohsiung, Taiwan
Abstract :
Optimization of buffer access is one of the critical design issues of graphics rendering systems especially for embedded applications where the memory bandwidth is very limited. This paper presents an efficient hierarchical fill-buffer architecture for two-dimensional (2D) graphics rendering systems. The fill-buffer is used to determine the interior regions of graphics objects and consumes considerable memory bandwidth during the rendering process. By using an additional level of auxiliary buffer to denote the status of blocks of fill-buffer entries, the proposed method cannot only clear the fill-buffer efficiently with much less cycles and data transfer, but also accelerate the winding-count accumulation process significantly. Our experimental results show that the number of data accesses can be reduced by more than a factor of 3. If the auxiliary buffer is placed on-chip, the off-chip memory bandwidth can be reduced by more than a factor of 10. The other salient feature of the proposed fill-buffer is that it can be integrated with the depth buffer used in three-dimensional (3D) graphics in order to reduce the overall cost by sharing the same buffer circuits.
Keywords :
buffer circuits; rendering (computer graphics); storage management; 2D graphics rendering systems; 3D graphics; auxiliary buffer; buffer access; buffer circuits; critical design issues; data access; data transfer; depth buffer; embedded applications; fill-buffer entry; graphics objects; hierarchical fill-buffer architecture; interior regions; off-chip memory bandwidth; optimization; rendering process; salient feature; three-dimensional graphics; two-dimensional graphics rendering systems; two-level hierarchical fill-buffer; winding-count accumulation process; Bandwidth; Graphics processing units; Rendering (computer graphics); System-on-chip; Vectors; Windings;
Conference_Titel :
New Circuits and Systems Conference (NEWCAS), 2013 IEEE 11th International
Conference_Location :
Paris
Print_ISBN :
978-1-4799-0618-5
DOI :
10.1109/NEWCAS.2013.6573604