Effects of nanofiber materials of nanofiber anisotropic conductive adhesives (nanofiber ACAs) for ultra-fine pitch electronic assemblies

Author

Kyoung-Lim Suk ; Kyung-Wook Paik

Author_Institution

Dept. of Mater. Sci. & Eng., KAIST, Daejeon, South Korea

fYear

2013

fDate

28-31 May 2013

Firstpage

118

Lastpage

123

Abstract

We investigate the effects of material properties of nanofiber on fine pitch ACA interconnection stability in terms of thermal and mechanical properties. Three kinds of nanofiber materials, polyvinylidene fluoride (PVDF), ethylene vinyl alcohol (EVOH), and Nylon 6, which have different tensile properties and melting temperatures, are coupled with conductive particles to form PVDF-CPIN, EVOH-CPIN, and Nylon 6-CPIN, respectively, and the three nanofiber ACAs are fabricated and characterized.

Keywords

conductive adhesives; electrospinning; fine-pitch technology; materials testing; nanofibres; EVOH-CPIN; Nylon 6-CPIN; PVDF-CPIN; ethylene vinyl alcohol; fine pitch ACA interconnection stability; melting; nanofiber ACA; nanofiber anisotropic conductive adhesives; nanofiber materials; polyvinylidene fluoride; tensile properties; ultra-fine pitch electronic assemblies; Contact resistance; Insulation; Nanostructured materials; Polymers; Resins; Temperature measurement;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd

Conference_Location

Las Vegas, NV

ISSN

0569-5503

Print_ISBN

978-1-4799-0233-0

Type

conf

DOI

10.1109/ECTC.2013.6575560

Filename

6575560