• DocumentCode
    628372
  • Title

    A highly integratable millimeter-wave silicon waveguide array for Terabit application

  • Author

    Qidong Wang ; Guidotti, Daniel ; Jie Cui ; Liqiang Cao ; Tianchun Ye ; Lixi Wan

  • Author_Institution
    Key Lab. of Microelectron. Devices & Integrated Technol., Inst. of Microelectron., Beijing, China
  • fYear
    2013
  • fDate
    28-31 May 2013
  • Firstpage
    140
  • Lastpage
    145
  • Abstract
    Multi-core scalar CPU are approaching processing rates of 256 GFLOPS. Transport latency and bandwidth (BW) between DRAM and processor are a substantial bottleneck to optimal system performance. This is, in large part, because board level, data transport occurs over legacy L-C transmission lines having limited BW over a limited distance. Consequently, high performance, systems running memory intensive applications are able to utilize only a fraction of their available computational potential and remain idle for many clock cycles while waiting for data and instructions. This paper proposes guided millimeter wave on a socket as a BW scalable inter-chip communication interface. Scalability is afforded by high order digital modulation of the guided carrier wave and the wide, re-usable, free spectral range within each waveguide that can accommodate multiple full duplex channels.
  • Keywords
    DRAM chips; elemental semiconductors; millimetre wave devices; modulation; multiprocessing systems; peripheral interfaces; silicon; transmission lines; waveguides; BW scalable interchip communication interface; DRAM; GFLOPS; L-C transmission lines; Si; clock cycles; free spectral range; full duplex channels; guided carrier wave; high order digital modulation; integratable millimeter waveguide array; memory intensive applications; multicore scalar CPU; terabit application; transport latency; Arrays; Bandwidth; Optical waveguides; Probes; Random access memory; Silicon;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
  • Conference_Location
    Las Vegas, NV
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4799-0233-0
  • Type

    conf

  • DOI
    10.1109/ECTC.2013.6575564
  • Filename
    6575564