Modeling, design, and fabrication of ultra-high bandwidth 3D Glass Photonics (3DGP) in glass interposers

Author

Chou, Bruce C. ; Sato, Yuuki ; Sukumaran, Vijay ; Jibin Sun ; Sundaram, Venky ; Gee-Kung Chang ; Tummala, Rao

Author_Institution

D Syst. Packaging Res. Center, Georgia Inst. of Technol., Atlanta, GA, USA

fYear

2013

fDate

28-31 May 2013

Firstpage

286

Lastpage

291

Abstract

This paper presents, for the first time, the 3D Glass Photonics (3DGP) technology being developed by Georgia Tech, based on ultra-thin 3D glass interposer [1]. The 3DGP system integrates both optical and electrical interconnects in the same glass substrate using photo-sensitive polymer core, and polymer cladding within an ultra-thin glass substrate. The 3DGP processes are demonstrated using 180 & 100 um thick glass substrates with 30 um diameter via and 8 um wide waveguide structures. The optical vias are used as mode transformer and high-tolerance coupler between fibers and chips. Finite-difference analysis is performed to determine the alignment tolerances of such vias.

Keywords

finite difference methods; glass; integrated optics; optical fabrication; optical fibre cladding; optical interconnections; optical waveguides; polymers; 3DGP technology; electrical interconnection; finite-difference analysis; glass interposers; high-tolerance coupler; mode transformer; optical interconnection; photo-sensitive polymer core; polymer cladding; size 100 mum; size 180 mum; size 30 mum; ultra-thin glass substrate; ultrahigh bandwidth 3D glass photonics; wide waveguide structures; Glass; Optical device fabrication; Optical fibers; Optical refraction; Optical variables control; Substrates;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd

Conference_Location

Las Vegas, NV

ISSN

0569-5503

Print_ISBN

978-1-4799-0233-0

Type

conf

DOI

10.1109/ECTC.2013.6575585

Filename

6575585