Strip warpage analysis of a flip chip package considering the mold compound processing parameters

In this paper we will demonstrate and present an analysis methodology to account for the processing parameters, particularly the manufacturing and processing of mold compound materials, to form flip chip packages on a substrate strip. The impact of manufacturing parameters such as pressure, temperature, shrinkage, and processing timing on strip warpage will all be considered and modeled. The commercial finite element tools are used in the study. The factorial analysis is conducted to determine which parameter is more dominant. Furthermore, a series of experiments are conducted to compare the numerical data. This result shows that the proposed modeling methodology is able to obtain better match of the experiment vs. simulation data than a traditional mechanical analysis.