DocumentCode
628433
Title
Substrate reflectivity study for high brightness LED package
Author
Chieh-Lung Lai ; Song-Chun Wu ; Jui-Feng Lai ; Hsien-Wen Chen
Author_Institution
Siliconware Precision Ind. Co., Ltd., Taichung, Taiwan
fYear
2013
fDate
28-31 May 2013
Firstpage
541
Lastpage
545
Abstract
Luminous efficacy is key performance index for LED package. Conventional LED used plastic compound and silver plating as reflective surface. In this paper, we discussed the relation between roughness and reflectivity and the relation between reflectivity of substrate surface and luminous efficacy. We used aluminum alloy A6063-T5 as LED package substrate. There are three surface treatments - diamond cutting, diamond cutting with anodizing treatment, and blue clay polishing that are used on LED package substrates. From substrate machining results, we found there is no relation between roughness and surface reflectivity. From optical simulation and LED packaging results, we found there is positive relation between substrate reflectivity and luminous efficacy. The reflectivity at 550~600nm dominates the LED luminous efficacy.
Keywords
aluminium alloys; brightness; cutting; electroplating; light emitting diodes; packaging; reflectivity; substrates; aluminum alloy A6063-T5; anodizing treatment; blue clay polishing; diamond cutting; high brightness LED package substrate; luminous efficacy; optical simulation; plastic compound; reflective surface; roughness; silver plating; size 550 nm to 600 nm; substrate machining; substrate reflectivity study; surface reflectivity; surface treatments; Diamonds; Light emitting diodes; Optical reflection; Phosphors; Reflectivity; Substrates; Surface treatment;
fLanguage
English
Publisher
ieee
Conference_Titel
Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
Conference_Location
Las Vegas, NV
ISSN
0569-5503
Print_ISBN
978-1-4799-0233-0
Type
conf
DOI
10.1109/ECTC.2013.6575625
Filename
6575625
Link To Document