• DocumentCode
    628433
  • Title

    Substrate reflectivity study for high brightness LED package

  • Author

    Chieh-Lung Lai ; Song-Chun Wu ; Jui-Feng Lai ; Hsien-Wen Chen

  • Author_Institution
    Siliconware Precision Ind. Co., Ltd., Taichung, Taiwan
  • fYear
    2013
  • fDate
    28-31 May 2013
  • Firstpage
    541
  • Lastpage
    545
  • Abstract
    Luminous efficacy is key performance index for LED package. Conventional LED used plastic compound and silver plating as reflective surface. In this paper, we discussed the relation between roughness and reflectivity and the relation between reflectivity of substrate surface and luminous efficacy. We used aluminum alloy A6063-T5 as LED package substrate. There are three surface treatments - diamond cutting, diamond cutting with anodizing treatment, and blue clay polishing that are used on LED package substrates. From substrate machining results, we found there is no relation between roughness and surface reflectivity. From optical simulation and LED packaging results, we found there is positive relation between substrate reflectivity and luminous efficacy. The reflectivity at 550~600nm dominates the LED luminous efficacy.
  • Keywords
    aluminium alloys; brightness; cutting; electroplating; light emitting diodes; packaging; reflectivity; substrates; aluminum alloy A6063-T5; anodizing treatment; blue clay polishing; diamond cutting; high brightness LED package substrate; luminous efficacy; optical simulation; plastic compound; reflective surface; roughness; silver plating; size 550 nm to 600 nm; substrate machining; substrate reflectivity study; surface reflectivity; surface treatments; Diamonds; Light emitting diodes; Optical reflection; Phosphors; Reflectivity; Substrates; Surface treatment;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
  • Conference_Location
    Las Vegas, NV
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4799-0233-0
  • Type

    conf

  • DOI
    10.1109/ECTC.2013.6575625
  • Filename
    6575625