An improved model for predicting fatigue-crack propagation behaviors in multiple solder bumps on a BGA package

Author

Terasaki, Takeshi ; Tanie, Hisashi ; Nakatsuka, Tetsuya ; Kurauchi, Satoshi ; Yamashita, Takayoshi ; Furusawa, Yoshihito ; Imai, H.

Author_Institution

Hitachi, Ltd., Hitachinaka, Japan

fYear

2013

fDate

28-31 May 2013

Firstpage

731

Lastpage

739

Abstract

A previously developed model for predicting the behavior of fatigue crack propagation in a solder bump on a BGA package has now been improved by switching to the use of a commercial structural analysis code, ADVENTURECluster, which supports large-scale nonlinear finite-element analysis based on parallel processing and the implicit method. The improved model can predict fatigue-crack-propagation behavior in dozens of solder joints in one analysis. The results of testing this improved “modified accumulated damage model” were in good agreement with experimental results, indicating that the improved model can accurately predict the behavior of fatigue crack propagation in multiple solder bumps and predict the fatigue life of each solder bump on a BGA package.

Keywords

ball grid arrays; electronic engineering computing; fatigue cracks; finite element analysis; integrated circuit packaging; parallel processing; solders; ADVENTURECluster; BGA package; ball grid array; commercial structural analysis code; fatigue crack propagation behavior; implicit method; large scale nonlinear finite element analysis; modified accumulated damage model; multiple solder bump; parallel processing method; Analytical models; Fatigue; Finite element analysis; Plastics; Predictive models; Soldering; Strain;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd

Conference_Location

Las Vegas, NV

ISSN

0569-5503

Print_ISBN

978-1-4799-0233-0

Type

conf

DOI

10.1109/ECTC.2013.6575654

Filename

6575654