Use of compliant interconnects for drop impact isolation

Compliant interconnects are able to mechanically decouple die from substrate and are helpful in reducing thermally-induced stresses in the die. In this paper, we report drop-test modeling of die-substrate assemblies with compliant interconnects. Simulations using explicit ANSYS/LS-DYNA^® solver were carried out to mimic typical experimental conditions and to gain a better understanding of the overall response of the compliant interconnects under shock and impact loading. The finite-element models simulated dropping of die-substrate assemblies with compliant interconnects from different heights. The results from these simulations were compared against drop simulations of die-substrate assemblies with bump interconnects. The simulation results show that the compliant interconnects can significantly reduce the strains in the die under drop testing, while the bump interconnect does not have such an advantage.