Micro-bump bondability design guidelines for high throughput 2.5D & 3D IC assemblies

Author

Chang-Lin Yeh ; Yung-Yi Yeh ; Jen-Chieh Kao ; Tong Hong Wang ; Chang-Chi Lee ; Ho-Ming Tong

Author_Institution

Group R&D, Adv. Semicond. Eng., Inc., Kaohsiung, Taiwan

fYear

2013

fDate

28-31 May 2013

Firstpage

897

Lastpage

903

Abstract

In this paper, mechanical bonding behaviors of micro-bumps in 2.5D/3D ICs assembly are studied theoretically. Solder force and spring constant of micro-bumps with different bond pad structures are estimated by using Surface Evolver. Deformations of dies with corresponding flattening distances are evaluated based on flexural theory and three-dimensional contact theories. Allowable coplanarity of bond surface or die warpage during both mass reflow and thermal compression bond is developed. Guidelines to ensure successful bond and corresponding structural designs are earned.

Keywords

deformation; integrated circuit bonding; integrated circuit design; microassembling; solders; three-dimensional integrated circuits; 2.5D IC assembly; 3D IC assembly; bond pad structure; bond surface coplanarity; die deformation; die warpage; flattening distance; flexural theory; mass reflow; mechanical bonding behavior; microbump bondability design guideline; solder force; spring constant; structural design; surface evolver; thermal compression bond; three-dimensional contact theory; Bonding; Equations; Force; Integrated circuits; Shape; Springs; Stacking;

fLanguage

English

Publisher

ieee

Conference_Titel

Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd

Conference_Location

Las Vegas, NV

ISSN

0569-5503

Print_ISBN

978-1-4799-0233-0

Type

conf

DOI

10.1109/ECTC.2013.6575680

Filename

6575680