Nano-Silica Composite Laminate

This paper introduces a newly-developed Nano-Silica Composite Laminate packaging technology that utilizes a nano-silica matrix composite material with outstanding properties. Nano-Silica Composite Laminate packaging technology enables us to create a thinner, downsized packaging that is less susceptible to warpage. In order to verify the advantageous properties of Nano-Silica Composite Laminate, we measured the degree of warpage by utilizing a dielectric test substrate that was composed of Nano-Silica Composite Laminate and resin films. The results obtained in this study demonstrated that the dielectric material created using Nano-Silica Composite Laminate allows us to avoid the resin´s undesirable tendency of allowing the coefficient of thermal expansion (CTE) to increase when the temperature rises beyond the glass transition temperature. The storage modulus of Nano-Silica Composite Laminate showed 30 GPa, which is more than five times higher than that of ordinary resin. Therefore, we were able to confirm that using Nano-Silica Composite Laminate contributes to decreasing warpage of the conventional substrate during the packaging process. Furthermore, we confirmed that the test substrate has the following extremely reliable properties: it can maintain both conductivity and dielectricity under the conditions of both a line/space width of 10/10μm and a via diameter of 30 μm. Consequently, through the test results it has been confirmed that Nano-Silica Composite Laminate is one of the most appropriate substrates available to strengthen the interconnection between a silicon chip and substrate, and to protect the large-scale integrated (LSI) circuits from breaking.