Multi-layer adaptive power management architecture for TSV 3DIC applications

In this work, a multi-layer hierarchical distributed power delivery architecture for TSV 3DIC is proposed. By decoupling global and local power networks, the proposed power delivery architecture can be flexibly configured for different power requests. The decoupled power architectures can also greatly reduce the required decoupling capacitor sizes for voltage stabilization. Meanwhile, a multi-threshold CMOS switched capacitor DC-DC converter with up to 78% power efficiency is implemented in 65nm CMOS for hierarchical distributed power delivery architecture. An adaptive power management technique is presented to work in the local power network to increase the power efficiency. The proposed multi-layer hierarchical distributed power delivery architecture is also very useful for the heterogeneous integration in 3DIC chips.