• DocumentCode
    628712
  • Title

    D-Band characterization of co-planar wave guide and microstrip transmission lines on liquid crystal polymer

  • Author

    Khan, Wasif T. ; Ulusoy, A. Cagri ; Papapolymerou, John

  • Author_Institution
    Sch. of Electr. & Comput. Eng., Georgia Inst. of Technol., Atlanta, GA, USA
  • fYear
    2013
  • fDate
    28-31 May 2013
  • Firstpage
    2304
  • Lastpage
    2309
  • Abstract
    In this paper, for the first time, characterization of planar transmission lines on organic Liquid Crystal Polymer (LCP) substrate in D-Band is presented. Via-less conductor backed co-planar wave guide (CB-CPW) and microstrip lines are designed, fabricated and measured on 2 mil organic LCP substrate. Line-reflect-reflect-match (LRRM) calibration technique was used to measure the fabricated lines, whereas in order to accurately extract line loss and to characterize the substrate, a thru-reflect-line (TRL) calibration was performed. The results have shown excellent RF performance of LCP in the D-band, while the microstrip line exhibits a loss of 0.1755 dB/mm at 110 GHz, with a monotonous increase to 0.331dB/mm at 170 GHz. An almost constant (~2.6) effective dielectric constant is also reported within the whole measurement band.
  • Keywords
    calibration; coplanar transmission lines; coplanar waveguides; liquid crystal polymers; microstrip lines; permittivity; CB-CPW; D-band characterization; LRRM calibration technique; RF performance; TRL calibration; dielectric constant; fabricated lines; frequency 110 GHz; frequency 170 GHz; line-reflect-reflect-match calibration technique; measurement band; microstrip lines; microstrip transmission lines; organic LCP substrate; organic liquid crystal polymer substrate; planar transmission lines; thru-reflect-line calibration; via-less conductor backed coplanar wave guide; Calibration; Coplanar waveguides; Dielectric measurement; Loss measurement; Microstrip; Substrates; Transmission line measurements;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Electronic Components and Technology Conference (ECTC), 2013 IEEE 63rd
  • Conference_Location
    Las Vegas, NV
  • ISSN
    0569-5503
  • Print_ISBN
    978-1-4799-0233-0
  • Type

    conf

  • DOI
    10.1109/ECTC.2013.6575905
  • Filename
    6575905