DocumentCode
629028
Title
A one week-lecture in the Euro-dots course program: Microelectronic assemblies: From packaging to reliability
Author
Debeda, Helene ; Favre, Isabelle ; Gracia, Alexandrine ; Labat, N. ; Plano, B. ; Fremont, H.
Author_Institution
Lab. IMS, Univ. de Bordeaux, Talence, France
fYear
2013
fDate
30-31 May 2013
Firstpage
121
Lastpage
127
Abstract
The course “Microelectronic assemblies: from packaging to reliability” is a one-week-course module within the Euro-dots program proposed at the IMS Laboratory, University Bordeaux, with lectures illustrated by labs. It takes benefits from expertise of different teachers and research teams and also technological, failure analysis and characterization platforms.
Keywords
electronics packaging; failure analysis; microassembling; reliability; Euro-dots course program; IMS Laboratory; University Bordeaux; eliability; failure analysis; microelectronic assemblies; packaging; Assembly; Failure analysis; Materials; Microelectronics; Packaging; Reliability; Wires; COB; SMT; failure; high level lecture; microelectronic assembly; packaging; reflow; reliability; solder; wire-bonding;
fLanguage
English
Publisher
ieee
Conference_Titel
EAEEIE Annual Conference (EAEEIE), 2013 Proceedings of the 24th
Conference_Location
Chania
Print_ISBN
978-1-4799-0042-8
Type
conf
DOI
10.1109/EAEEIE.2013.6576514
Filename
6576514
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