Title :
High-performance inductors for integrated fan-out wafer level packaging (InFO-WLP)
Author :
Chen, S.M. ; Huang, L.H. ; Yeh, J.H. ; Lin, Y.J. ; Kuo, F.W. ; Chen, H.N. ; Chiu, M.Y. ; Liu, C.C. ; Yeh, Jen-Hao ; Yeh, T.J. ; Hou, S.Y. ; Hung, J.P. ; Lin, J.C. ; Jou, C.P. ; Jeng, S.P. ; Yu, Daren
Author_Institution :
Taiwan Semicond. Manuf. Co., Ltd., Hsinchu, Taiwan
Abstract :
Integrated fan-out wafer-level packaging (InFO-WLP) technology with state-of-the-art quality factor (Q) = 64 in 2.4GHz inductor has been demonstrated for RF systems. For the first time, radio frequency (RF) circuits with InFO-WLP have been fabricated to illustrate how the high Q inductor can be used to dramatically improve performance and power consumption concurrently.
Keywords :
Q-factor; UHF integrated circuits; inductors; wafer level packaging; InFO-WLP; RF circuit; frequency 2.4 GHz; high-performance inductor; integrated fan-out wafer-level packaging technology; power consumption; quality factor; radiofrequency circuit; Frequency measurement; Inductors; Noise measurement; Phase noise; Q-factor; System-on-chip; Voltage-controlled oscillators;
Conference_Titel :
VLSI Technology (VLSIT), 2013 Symposium on
Conference_Location :
Kyoto
Print_ISBN :
978-1-4673-5226-0
