• DocumentCode
    629196
  • Title

    A novel high performance WOx ReRAM based on thermally-induced SET operation

  • Author

    Wei-Chih Chien ; Ming-Hsm Lee ; Feng-Ming Lee ; Wei-Chen Chen ; Dai-Ying Lee ; Lin, Yu.-Yu. ; Erh-Kun Lai ; Hsiang-Lan Lung ; Kuang-Yeu Hsieh ; Chih-Yuan Lu

  • Author_Institution
    Emerging Central Lab., Macronix Int. Co., Ltd., Hsinchu, Taiwan
  • fYear
    2013
  • fDate
    11-13 June 2013
  • Abstract
    SET operation of unipolar transition-metal-oxide ReRAM is intrinsically difficult because the E-field is in an unfavorable direction (in the direction for RESET rather than SET), thus unipolar operation causes strong device degradation from the high current needed for SET operation. This work introduces a novel thermally induced SET operation that removes the high current stressing. By using an external heater we have provided heating without driving large current through the ReRAM device. This greatly improves the device performance and allows a high-density 1D1R array.
  • Keywords
    random-access storage; tungsten compounds; 1D1R array; E-field; RESET; ReRAM device; current stressing; device degradation; device performance; external heater; high performance WOx ReRAM; thermally induced SET operation; thermally-induced SET operation; unfavorable direction; unipolar operation; unipolar transition-metal-oxide ReRAM; Very large scale integration;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    VLSI Technology (VLSIT), 2013 Symposium on
  • Conference_Location
    Kyoto
  • ISSN
    0743-1562
  • Print_ISBN
    978-1-4673-5226-0
  • Type

    conf

  • Filename
    6576695