DocumentCode
629196
Title
A novel high performance WOx ReRAM based on thermally-induced SET operation
Author
Wei-Chih Chien ; Ming-Hsm Lee ; Feng-Ming Lee ; Wei-Chen Chen ; Dai-Ying Lee ; Lin, Yu.-Yu. ; Erh-Kun Lai ; Hsiang-Lan Lung ; Kuang-Yeu Hsieh ; Chih-Yuan Lu
Author_Institution
Emerging Central Lab., Macronix Int. Co., Ltd., Hsinchu, Taiwan
fYear
2013
fDate
11-13 June 2013
Abstract
SET operation of unipolar transition-metal-oxide ReRAM is intrinsically difficult because the E-field is in an unfavorable direction (in the direction for RESET rather than SET), thus unipolar operation causes strong device degradation from the high current needed for SET operation. This work introduces a novel thermally induced SET operation that removes the high current stressing. By using an external heater we have provided heating without driving large current through the ReRAM device. This greatly improves the device performance and allows a high-density 1D1R array.
Keywords
random-access storage; tungsten compounds; 1D1R array; E-field; RESET; ReRAM device; current stressing; device degradation; device performance; external heater; high performance WOx ReRAM; thermally induced SET operation; thermally-induced SET operation; unfavorable direction; unipolar operation; unipolar transition-metal-oxide ReRAM; Very large scale integration;
fLanguage
English
Publisher
ieee
Conference_Titel
VLSI Technology (VLSIT), 2013 Symposium on
Conference_Location
Kyoto
ISSN
0743-1562
Print_ISBN
978-1-4673-5226-0
Type
conf
Filename
6576695
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