• DocumentCode
    629657
  • Title

    Backscattering coefficient accurate model for nanoscale Si-MOSFET transistor

  • Author

    Rjoub, Abdoul ; Al-Mistarihi, Mamoun F. ; Al-Taradeh, Nedal R.

  • Author_Institution
    Comput. Eng. Dept., Jordan Univ. of Sci. & Technol., Irbid, Jordan
  • fYear
    2013
  • fDate
    20-21 June 2013
  • Firstpage
    1
  • Lastpage
    4
  • Abstract
    In this paper, a new model for total backscattering coefficient (RBT) is proposed for both elastic and inelastic carrier scattering in silicon metal oxide semiconductor field effect transistor (MOSFET) nanoscale devices. The effect of the injection velocity (Vinj) as a function of the electric field (E) and low field mobility (μ0) is included and analyzed for both the elastic and inelastic scattering. The channel potential profile, V(x), as a function of the channel length is also modeled. Inelastic scattering degrades the drain current (Ids) due to the charge accumulation effect. The mean free path (λ) is the same for both elastic and inelastic scattering and becomes independent from electric field at higher values. Simulation results of the proposed model and BSIM4 model using HSPICE with 22nm channel length show a very good agreement and high accuracy.
  • Keywords
    MOSFET; elemental semiconductors; semiconductor device models; silicon; BSIM4 model; HSPICE; Si; channel potential profile; charge accumulation effect; field mobility; inelastic carrier scattering; injection velocity; mean free path; metal oxide semiconductor field effect transistor; nanoscale Si-MOSFET transistor; size 22 nm; Backscatter; Electric fields; MOSFET; Mathematical model; Nanoscale devices; Scattering; Semiconductor device modeling; Back Scattering Coefficient (RB); Channel Potential Profile V(x); Injection Velocity (Vinj); Low Field Mobility (μ0); Mean Free Path (λ); Metal Oxide Semiconductor Field Effect Transistor (MOSFET);
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Faible Tension Faible Consommation (FTFC), 2013 IEEE
  • Conference_Location
    Paris
  • Print_ISBN
    978-1-4673-6105-7
  • Type

    conf

  • DOI
    10.1109/FTFC.2013.6577754
  • Filename
    6577754