Title :
New technique of sample preparation for 3DIC micro_bumps observation
Author :
Chun-An Huang ; Han-Yun Long ; King-Ting Chiang ; Li Chuang ; Tsui, Kai-Man
Author_Institution :
Integrated Service Technol. Inc., Hsinchu, Taiwan
Abstract :
Two new preparation methods of silicon substrates in the observation of micro-joint and micro-bumps failure mode were proposed in this study. One method is to use tilted grinding on 3DIC substrate to navigate the failed micro-joints. The other method can provide wider cross-section range by using ion polishing system studied in iST.
Keywords :
grinding; integrated circuit interconnections; integrated circuit packaging; integrated circuit reliability; integrated circuit testing; polishing; silicon; three-dimensional integrated circuits; 3D IC microbumps observation; Si; ion polishing system; microbumps failure mode; microjoint failure mode; sample preparation; tilted grinding; Copper; Electromigration; Failure analysis; Milling; Physics; Reliability; Substrates;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location :
Suzhou
Print_ISBN :
978-1-4799-1241-4
DOI :
10.1109/IPFA.2013.6599142
