• DocumentCode
    633853
  • Title

    Electrical properties of low-k dielectric in copper interconnect structures

  • Author

    Mingte Lin ; Liang, Justin ; Juan, Alfons ; Su, K.C.

  • Author_Institution
    United Microelectron. Corp., Hsinchu, Taiwan
  • fYear
    2013
  • fDate
    15-19 July 2013
  • Firstpage
    208
  • Lastpage
    211
  • Abstract
    The electrical properties, leakage current and capacitance, of inter and intra level low-k dielectrics are investigated thoroughly with different voltage bias conditions. The leakage currents show important bias polarity dependence with different conduction mechanisms and have stress effects on different structure designs. The novel nonlinear voltage dependence of inter level low-k capacitance at different temperature is demonstrated for the first time. This nonlinear voltage dependence is very important for capacitance linearity improvement consideration.
  • Keywords
    capacitance; copper; dielectric properties; electrical conductivity; interconnections; leakage currents; capacitance; capacitance linearity improvement; conduction mechanisms; electrical properties; interconnect structures; interlevel low-k dielectrics; intralevel low-k dielectrics; leakage current; nonlinear voltage dependence; voltage bias conditions; Capacitance; Dielectrics; Electric fields; Leakage currents; Metals; Reliability; Temperature measurement;
  • fLanguage
    English
  • Publisher
    ieee
  • Conference_Titel
    Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
  • Conference_Location
    Suzhou
  • ISSN
    1946-1542
  • Print_ISBN
    978-1-4799-1241-4
  • Type

    conf

  • DOI
    10.1109/IPFA.2013.6599154
  • Filename
    6599154