DocumentCode
633853
Title
Electrical properties of low-k dielectric in copper interconnect structures
Author
Mingte Lin ; Liang, Justin ; Juan, Alfons ; Su, K.C.
Author_Institution
United Microelectron. Corp., Hsinchu, Taiwan
fYear
2013
fDate
15-19 July 2013
Firstpage
208
Lastpage
211
Abstract
The electrical properties, leakage current and capacitance, of inter and intra level low-k dielectrics are investigated thoroughly with different voltage bias conditions. The leakage currents show important bias polarity dependence with different conduction mechanisms and have stress effects on different structure designs. The novel nonlinear voltage dependence of inter level low-k capacitance at different temperature is demonstrated for the first time. This nonlinear voltage dependence is very important for capacitance linearity improvement consideration.
Keywords
capacitance; copper; dielectric properties; electrical conductivity; interconnections; leakage currents; capacitance; capacitance linearity improvement; conduction mechanisms; electrical properties; interconnect structures; interlevel low-k dielectrics; intralevel low-k dielectrics; leakage current; nonlinear voltage dependence; voltage bias conditions; Capacitance; Dielectrics; Electric fields; Leakage currents; Metals; Reliability; Temperature measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location
Suzhou
ISSN
1946-1542
Print_ISBN
978-1-4799-1241-4
Type
conf
DOI
10.1109/IPFA.2013.6599154
Filename
6599154
Link To Document