Study on low silver Sn-Ag-Cu-P alloy for wave soldering

Author

Junjie Wang ; Xicheng Wei ; Wenqi Zhu ; Jian Wu ; Nianzu Wu

Author_Institution

Sch. of Mater. Sci. & Eng., Shanghai Univ., Shanghai, China

fYear

2013

fDate

15-19 July 2013

Firstpage

485

Lastpage

489

Abstract

In recent years, it´s a tendency that many researchers are focusing on low Ag lead-free solder due to high cost of silver. However, it´s inevitable that the oxidation may arise because of higher content of tin, especially in wave soldering. In this study, the melting point, hardness, microstructure, wettability and anti-oxidation property of Sn-0.3Ag-0.7Cu-0.004P solder (SACP) were researched and compared with those of Sn-0.3Ag-0.7Cu (SAC). SACP had better oxidation resistance and poorer wettability than SAC, and their melting characteristics were similar.

Keywords

copper; oxidation; phosphorus alloys; silver; silver alloys; solders; tin alloys; wave soldering; wetting; antioxidation property; hardness property; low-silver alloy; low-silver lead-free solder; melting characteristics; melting point; oxidation resistance; tin content; wave soldering; wettability property; Lead; Microstructure; Oxidation; Resistance; Soldering; Tin; P; Sn-0.3Ag-0.7Cu; lead-free solder; low Ag;

fLanguage

English

Publisher

ieee

Conference_Titel

Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the

Conference_Location

Suzhou

ISSN

1946-1542

Print_ISBN

978-1-4799-1241-4

Type

conf

DOI

10.1109/IPFA.2013.6599206

Filename

6599206