Title :
Investigation of EOS damage issue induced by failure analysis on back-end test vehicle
Author :
Hong Bo Zhang ; Kaeng Nan Liew ; Ren De Lin
Author_Institution :
United Microelectron. Corp. (Singapore Branch), Ltd., Singapore, Singapore
Abstract :
Back-end Test Vehicle (BTV) test-key responds to BEOL status effectively. In different process node, it can assist in monitoring real product process inline BEOL status by using fewer process steps. FA is very important steps to confirm the failure Device-Under-Test (DVT) for yield improvement in the BTV validation flow. FA has more and more challenges in advanced process nodes, one of them is EOS damage issue, which issue occurred during the BTV test-key failure analysis in advanced process node. The EOS didn´t come out previous process node and above. This paper will investigate which FA steps on earth happened EOS damage, after that, EOS root cause and solved method was discussed base on experiment result.
Keywords :
failure analysis; integrated circuit testing; integrated circuit yield; BTV test-key failure analysis; BTV validation flow; EOS damage issue; EOS root cause; FA; back-end test vehicle; failure DVT; failure device-under-test; process node; real product process inline BEOL status; yield improvement; Chemicals; Earth Observing System; Grounding; Layout; Metals; Monitoring; Performance evaluation;
Conference_Titel :
Physical and Failure Analysis of Integrated Circuits (IPFA), 2013 20th IEEE International Symposium on the
Conference_Location :
Suzhou
Print_ISBN :
978-1-4799-1241-4
DOI :
10.1109/IPFA.2013.6599220