DocumentCode
636262
Title
Characterization of pressure reduction in coil-filled aneurysm under flow of human blood with and without anti-coagulant
Author
Lam, Alexander K. N. ; Ko, Match W. L. ; Leung, Leo K. K. ; Kwok, John C. K. ; Yuen, M.M.F. ; Lam, D.C.C.
Author_Institution
Mech. Eng. Dept., Hong Kong Univ. of Sci. & Technol., Hong Kong, China
fYear
2013
fDate
3-7 July 2013
Firstpage
739
Lastpage
742
Abstract
Filling aneurysms with embolization coils is a widely used part of the treatment to stop intracranial aneurysm from rupturing. However, the effect of coiling on aneurysmal pressure has not been established. In this study, the effect of intra-aneurysmal coiling on pressure reduction was characterized. Coil deployment in the aneurysm will disturb flow and may induce aneurysmal coagulation. These effects were experimentally examined in this study using silicone rubber saccular aneurysm models. Changes in aneurysmal blood pressure under pulsatile flow were characterized. With coils in the aneurysm, results showed that flow reduction of anti-coagulated blood in the aneurysm did not reduce aneurysmal pressure. Significant pressure reduction was observed only when the blood´s coagulation ability is restored to normal. These results suggest that blood coagulation is pivotal to pressure reduction and concomitant with rupture risk reduction in treatments of aneurysm with coils.
Keywords
biomedical materials; blood; coils; diseases; fracture; haemodynamics; patient treatment; physiological models; pulsatile flow; silicone rubber; aneurysmal blood pressure; anticoagulant; blood coagulation; coil-filled aneurysm; embolization coil; human blood flow; intraaneurysmal coiling effect; intracranial aneurysm treatment; pressure reduction characterization; pulsatile flow; rupture risk reduction; silicone rubber saccular aneurysm model; Aneurysm; Blood flow; Coagulation; Coils; Embolization; Pressure measurement;
fLanguage
English
Publisher
ieee
Conference_Titel
Engineering in Medicine and Biology Society (EMBC), 2013 35th Annual International Conference of the IEEE
Conference_Location
Osaka
ISSN
1557-170X
Type
conf
DOI
10.1109/EMBC.2013.6609606
Filename
6609606
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